Brief: Discover the Tiny Modules 4 Inch Waffle Pack Chip Trays, designed for ESD stability and anti-static protection. Perfect for transporting and handling bare dies, these trays are customizable, high-temperature resistant, and compliant with international environmental standards. Ideal for wafer dies, PCBA modules, and electronic component packaging.
Related Product Features:
Customized high-temperature resistant Waffle Pack for carrying tiny modules.
ESD stable and anti-static performance to protect chips from damage.
Lightweight and small size, reducing transportation costs.
Each tray accommodates a large number of chips for efficient testing and transfer.
Excellent flatness for easy operation on automatic equipment.
Compatible with covers and clips for versatile shipping methods.
Recyclable and biodegradable plastic material, environmentally friendly.