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We are pleased to announce that Hiner-pack® is now exhibiting at SEMICON China 2026, taking place March 25–27, 2026 at the Shanghai New International Expo Centre. SEMICON China is one of the most influential events in the global semiconductor industry, bringing together manufacturers, suppliers, and technology leaders to showcase innovations across wafer fabrication, semiconductor packaging, and electronic component handling. At Booth E6-6755, Hiner-pack is presenting a comprehensive range of semiconductor packaging and handling solutions, including: JEDEC Trays / IC Trays Waffle Packs / Chip Trays / Bare Die Trays Wafer Carriers and Wafer Shipping Boxes Customized packaging solutions for semiconductor components Our products are designed to deliver ESD protection, dimensional stability, and automation compatibility, helping improve safety and efficiency throughout semiconductor manufacturing, storage, and transportation processes. Visitors are welcome to meet our team to:Explore our latest packaging solutionsDiscuss custom design requirementsLearn about material options for different temperature and cleanliness conditions Discover reliable handling solutions for ICs, wafers, and electronic components Exhibition InformationEvent: SEMICON China 2026Date: March 25–27, 2026Venue: Shanghai New International Expo Centre, Shanghai, ChinaBooth: E6-6755 We look forward to meeting industry partners and customers during the exhibition.

On March 24, 2025, QYResearch Market Research Publishing House released the report "2025-2031 Global and Chinese Plastic IC JEDEC Tray Market Status and Future Development Trends," which revealed that the global sales of plastic JEDEC trays reached USD 371 million in 2024. With the continued prosperity of the global semiconductor industry, market demand is expected to rise steadily in the coming years. As a professional solution provider in the semiconductor packaging sector, Hiner Pack leverages its deep expertise in technology research and development, the application of eco-friendly materials, and customized services to seize market opportunities. It offers global clients JEDEC tray products that better meet the needs of the advanced semiconductor industry. 1.Behind Global Market Growth, Hiner Pack Precisely Targets Core Needs The report highlights that technological advancements in the semiconductor industry are one of the core drivers of growth in the JEDEC tray market. With the increasing integration of chips and the shift towards high-density, small-sized packaging forms such as BGA, QFP, and LQFP, there are increasingly stringent requirements for protection against electrostatic discharge, moisture, and dimensional stability during transportation and storage. Hiner Pack anticipated this trend years ago and established a dedicated research and development team to optimize the performance of its JEDEC tray products for advanced packaging needs, perfectly meeting the carrying requirements of high-end chips.   2. Environmental Trends Drive New Growth, Hiner Pack Fulfills Sustainability Commitments As global environmental awareness strengthens, the "green supply chain" has become a crucial development direction in the semiconductor industry. The report specifically mentions that "researching and developing eco-friendly, recyclable JEDEC tray materials and production processes" will become a new growth point in the market. Hiner Pack actively responds to this trend by integrating environmental concepts throughout the entire lifecycle of its products, from material selection and production processes to recycling.   3. Looking Ahead, Hiner Pack Continues to Expand Market Boundaries Facing the vast prospects of the JEDEC tray market, Hiner Pack not only focuses on upgrading the performance and environmental optimization of its existing products but also actively explores intelligent and customized solutions. It provides rapid customization services for clients with special packaging needs, shortening the cycle from design and mold development to mass production to 15-20 days, which is 30% faster than the industry average. It has already customized exclusive tray solutions for multiple chip design companies.

From September 10 to 12, 2025, the Shenzhen World Convention and Exhibition Center hosted the annual grand event in the semiconductor industry—the SEMI-e Shenzhen International Semiconductor Exhibition and the 2025 Integrated Circuit Industry Innovation Exhibition. As a key player in the field of semiconductor packaging, Hiner-Pack made a stunning appearance with a series of cutting-edge solutions and innovative products in semiconductors and chips, showcasing the innovative achievements in the semiconductor industry alongside numerous high-quality enterprises in the sector, and attracting a large number of professional visitors to stop and exchange ideas. This exhibition boasted a massive scale, with an exhibition area of 60,000 square meters, covering the entire semiconductor industry ecosystem, including end-use applications, chip design, wafer manufacturing, packaging and testing, equipment and materials, EDA/IP, and other links. At the same time, the exhibition was held concurrently and at the same venue as the 26th China International Optoelectronic Exposition (CIOE), creating a powerful industrial synergy of "optoelectronics + semiconductors" and bringing unprecedented cross-border cooperation opportunities for participating enterprises and visitors. Hiner-Pack's booth (Booth Number: 14J03) attracted attention with its simple yet technologically sophisticated design. At this exhibition, we highlighted our new generation of semiconductor packaging products, which utilize newly developed high-performance composite materials. These products not only possess excellent anti-static and moisture-proof properties but also achieve a qualitative leap in dimensional stability and durability. In response to the needs of advanced packaging technologies, we have provided precisely adapted internal structural designs to ensure the safety and stability of semiconductor devices during transportation and storage. During the exhibition, Hiner-Pack's professional team engaged in in-depth exchanges with numerous visitors, providing detailed introductions to our product advantages and technological innovation points. Many enterprise representatives from fields such as chip manufacturing and packaging and testing showed strong interest in our products and held discussions on potential cooperation. A purchasing manager from a well-known chip manufacturing enterprise said, "The innovations in materials and design of Hiner-Pack's packaging products perfectly meet our stringent requirements for semiconductor device packaging. We look forward to establishing a long-term and stable cooperative relationship in the future." This participation in the exhibition was an important opportunity for Hiner-Pack to showcase its strength, expand industry exchanges, and grasp market trends. Through in-depth exchanges and cooperation with industry peers, we have further clarified market demands and technological development directions. In the future, Hiner-Pack will continue to increase its investment in research and development, continuously innovate, and strive to provide higher-quality and more efficient packaging solutions for the global semiconductor industry, helping the semiconductor industry reach new heights of development.

August 8,2025 – At Hiner-pack, all employees went to Nankunshan, a picturesque mountain with clear waters, to travel and sightsee. We emptied ourselves amidst the beautiful natural scenery, allowing our souls to return to nature and our lives to shine brightly. Ancient legend Nankunshan is located in the southwest of Longmen County, Huizhou City, Guangdong Province, China. It is a famous tourist attraction with a long history. Legend has it that in ancient times, Nankunshan was a desert. In order to change this situation, Lan Fen traveled across mountains and rivers to Fujian to find bamboo seedlings that were drought-tolerant, easy to grow, and could easily form forests. After ninety-nine days of traveling, he arrived in Fujian and collected bamboo seedlings. On his way back home, he encountered a major storm. Lan Fen was swept up into the air by a gust of wind and fell on the peak of Kunlun Mountain. Just as Lan Fen was crying because he thought the situation of Nankunshan could not be changed, he took a turn and met the god of Kunlun Mountain. The mountain god asked Lan Fen to find the Kunlun Map and, according to the map, build sixty-six mountains, each six feet high, in the desert. He used big stones as the bones, mud as the muscles, and planted different plants and flowers. By dripping six drops of blood on each mountain, an oasis would appear. In memory of this selfless young man, people named the mountain Lan Fen Mountain, and because it was obtained according to the Kunlun Map, it was also called Nankunshan. Pleasant journey On the way to the destination, everyone was in high spirits, talking about interesting people and things encountered in work and life, laughing from time to time, and creating a relaxed and joyful atmosphere. Upon arrival, everyone began to form teams to hike and play, eagerly starting this wonderful adventure with their companions. Due to the complex terrain, high mountains, and treacherous waters, many partners were initially afraid. However, with encouragement from each other, they regained their courage and firmly headed into the mysterious and beautiful forest. Along the way, everyone helped each other. Male colleagues carried things for female colleagues, and female colleagues took photos of male colleagues to document their journey, jointly exploring the singing birds and fragrant flowers in the forest. We escaped the hustle and bustle of the city, feeling freedom and happiness in the fresh air. At the end of the journey, everyone took a group photo to capture and preserve the beautiful moment forever.  And we also benefited greatly from this trip. Fearless pursuit: Just as Lan Fen pursued the oasis, we will never give up pursuing more excellent products; Bold attempts: Even if the road ahead is full of unknowns and dangers, we will boldly challenge and conquer; Valuable spirit of mutual assistance: We are a closely related collective. As long as we are in the same boat, all problems can be solved.

June 1, 2025 – At Hiner-pack, the timeless traditions of the Dragon Boat Festival (端午节) resonate deeply with our commitment to collaboration, innovation, and collective growth. As we reflect on this year’s celebration, we honor the festival’s enduring legacy and its profound alignment with our mission in advancing semiconductor packaging technologies. The Power of Shared Purpose Rooted in the ancient story of Qu Yuan, the Dragon Boat Festival symbolizes: • Unity: Like synchronized paddlers in a dragon boat, our teams move forward with shared vision. • Resilience: Navigating challenges with determination mirrors our pursuit of breakthroughs in advanced materials. • Renewal: Seasonal traditions inspire fresh energy as we accelerate toward our 2025 goals. Connecting Heritage to Hiner-pack’s Vision The festival’s ethos of “strength in unity” directly fuels our progress: • Precision & Collaboration: Just as crafting traditional zongzi demands meticulous skill, our R&D excellence thrives on cross-functional teamwork. • Sustainable Momentum: Our eco-friendly material innovations reflect the festival’s harmony with nature—advancing greener semiconductor solutions. • Global Mindset: Celebrating diverse traditions reinforces our inclusive culture and worldwide partnerships. Rowing Forward Together As we build on the momentum of early 2025, we carry the Dragon Boat Festival’s spirit into our core work:     "In every breakthrough—whether in materials science or sustainable manufacturing—we embody the festival’s legacy: one team, one rhythm, one mission." To the Hiner-pack family and partners worldwide: Thank you for driving progress with passion and purpose. Let’s continue pioneering the future of advanced materials, united in innovation.

March 26–28, 2025 | Shanghai New International Expo Center | Booth E6-6725 Shenzhen Hiner Advanced Materials Application Technology Co., Ltd. (Shenzhen Hiner Technology Co., LTD.) is thrilled to announce its participation in SEMICON/FPD China 2025, Asia’s premier event for the semiconductor and display industries. Under the theme “CONNECT•COLLABORATE•INNOVATE” this year’s exhibition will unite global innovators to shape the future of technology—and we invite you to join us at Booth E6-6725 to explore cutting-edge solutions in semiconductor packaging materials. Our team of experts will be on-site to discuss how our products empower efficiency, reduce environmental impact, and drive technological breakthroughs. Event Details Dates: March 26–28, 2025 Location: Shanghai New International Expo Centre Booth: E6-6725 Theme: CONNECT•COLLABORATE•INNOVATE  Let’s Innovate Together SEMICON China 2025 is more than an exhibition—it’s a platform to connect with industry pioneers, share knowledge, and inspire progress. Whether you’re a manufacturer, engineer, or tech visionary, we welcome you to visit Hiner-Pak’s booth and discover how our advanced materials can elevate your projects.