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High Temperature Standard JEDEC Tray IC Packaging

High Temperature Standard JEDEC Tray IC Packaging

Brand Name: Hiner-pack
Model Number: HN1809
MOQ: 1000 pcs
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
Payment Terms: T/T
Supply Ability: The capacity is between 2500PCS~3000PCS/per day
Detail Information
Place of Origin:
Made In China
Certification:
ISO 9001 ROHS SGS
Material:
PPE
Color:
Black
Temperature:
150°C
Property:
ESD
Surface Resistance:
1.0x10E4~1.0x10E11Ω
Flatness:
Less Than 0.76mm
Clean Class:
General And Ultrasonic Cleaning
Incoterms:
EXW,FOB,CIF,DDU,DDP
Packaging Details:
80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Supply Ability:
The capacity is between 2500PCS~3000PCS/per day
Highlight:

Jedec Conductive Tray

,

ESD Conductive Tray

,

ODM esd component tray

Product Description

High Temperature Standard JEDEC Tray IC Packaging

Discover JEDEC trays that offer the perfect fit, whether you’re packaging standard ICs or proprietary modules.


The tray has a 45-degree chamfer to provide a visual indicator of the Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip.


Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip storage. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.

Advantage:

1. Have exported for more than 12 years.
2. Have a professional engineer and efficient management
3. Delivery time is short, normally in stock.
4. A small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to the USA, Germany, the UK, Europe, Korea, Japan, etc.
7. The factory has an ISO certificate. The Product complies with the RoHS standard.

Application:

Electronic component, Semiconductor Embedded System, Display technology, Micro and Nano systems Sensor, Test and Measurement Technology, Electromechanical equipment and systems, Power supply.


Technical Parameters:

Brand Hiner-pack Outline Line Size 322.6*135.9*7.62mm
Model HN1809 Cavity Size 19.0*6.0*2.2 mm
Package Type IC Matrix QTY 11*12=132PCS
Material PPE Flatness MAX 0.76mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate RoHS

Reference to the temperature resistance of different materials:

Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature, and other special requirements can be customized

High Temperature Standard JEDEC Tray IC Packaging 0


FAQ


Q1: Are you a manufacturer?
A: Yes, we are a 100% manufacturer specialized in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.


Q2: What information should we supply if we want a quotation?
A: Drawing of your IC or component, Quantity, and size normally.

Q3: How long could you prepare samples?
A: Normally, 3 days. If customized, open a new mold 25~30 days around.

Q4: How about batch order production?
A: Normally, 5- 8 days or so.

Q5: Do you inspect the finished products?
A: Yes, we will do an inspection according to the ISO 9001 standard and be ruled by our QC staff.

High Temperature Standard JEDEC Tray IC Packaging 1