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High Temperature Standard JEDEC Tray IC Packaging

Brand Name:	Hiner-pack
Model Number:	HN1809
MOQ:	1000 pcs
Price:	$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms:	T/T
Supply Ability:	The capacity is between 2500PCS~3000PCS/per day

Detail Information

Product Description

Detail Information

Place of Origin:

Made In China

Certification:

ISO 9001 ROHS SGS

Material:

PPE

Color:

Black

Temperature:

150°C

Property:

ESD

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Flatness:

Less Than 0.76mm

Clean Class:

General And Ultrasonic Cleaning

Incoterms:

EXW,FOB,CIF,DDU,DDP

Packaging Details:

80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm

Supply Ability:

The capacity is between 2500PCS~3000PCS/per day

Highlight:

Jedec Conductive Tray

ESD Conductive Tray

ODM esd component tray

Product Description

High Temperature Standard JEDEC Tray IC Packaging

Discover JEDEC trays that offer the perfect fit, whether you’re packaging standard ICs or proprietary modules.

The tray has a 45-degree chamfer to provide a visual indicator of the Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip.

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip storage. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.

Advantage:

1. Have exported for more than 12 years.
2. Have a professional engineer and efficient management
3. Delivery time is short, normally in stock.
4. A small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to the USA, Germany, the UK, Europe, Korea, Japan, etc.
7. The factory has an ISO certificate. The Product complies with the RoHS standard.

Application:

Electronic component, Semiconductor Embedded System, Display technology, Micro and Nano systems Sensor, Test and Measurement Technology, Electromechanical equipment and systems, Power supply.

Technical Parameters:

Brand	Hiner-pack	Outline Line Size	322.6135.97.62mm
Model	HN1809	Cavity Size	19.06.02.2 mm
Package Type	IC	Matrix QTY	11*12=132PCS
Material	PPE	Flatness	MAX 0.76mm
Color	Black	Service	Accept OEM, ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	RoHS

Reference to the temperature resistance of different materials:

Material	Bake Temperature	Surface Resistance
PPE	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Powder	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Glass Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
PEI+Carbon Fiber	Max 180°C	1.010E4Ω~1.010E11Ω
IDP Color	85°C	1.010E6Ω~1.010E10Ω
Color, temperature, and other special requirements can be customized

High Temperature Standard JEDEC Tray IC Packaging 0

FAQ

Q1: Are you a manufacturer?
A: Yes, we are a 100% manufacturer specialized in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.

Q2: What information should we supply if we want a quotation?
A: Drawing of your IC or component, Quantity, and size normally.

Q3: How long could you prepare samples?
A: Normally, 3 days. If customized, open a new mold 25~30 days around.

Q4: How about batch order production?
A: Normally, 5- 8 days or so.

Q5: Do you inspect the finished products?
A: Yes, we will do an inspection according to the ISO 9001 standard and be ruled by our QC staff.

High Temperature Standard JEDEC Tray IC Packaging 1

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

High Temperature Standard JEDEC Tray IC Packaging

High Temperature Standard JEDEC Tray IC Packaging

Jedec Conductive Tray

ESD Conductive Tray

ODM esd component tray

High Temperature Standard JEDEC Tray IC Packaging

Advantage:

Application:

Technical Parameters: