Hiner-Pack has many years of design and manufacturing experience in the field of injection molding products. We have produced a wide range of injection molding packaging products to meet the requirements of automation equipment for many semiconductor design and testing customers.
Hiner-Pack is committed to the development and design of the most advanced Jedec Tray,IC Tray,Wafer Shipping Box..etc, the company has advanced mold processing and injection molding equipment.Equipped with a variety of testing equipment, to ensure product quality.Hiner-Pack designs and manufactures products that provide a complete range of levels of electrostatic protection for IC chips, modules and wafers, as well as a safe and convenient mode of transportation.A variety of materials are available to meet customers' requirements of temperature resistant baking.
