Hiner-Pack has many years of design and manufacturing experience in the field of injection molding products. We have produced a wide range of injection molding packaging products to meet the requirements of automation equipment for many semiconductor design and testing customers.
Hiner-Pack is committed to the development and design of the most advanced Jedec Tray,IC Tray,Wafer Shipping Box..etc, the company has advanced mold processing and injection molding equipment.Equipped with a variety of testing equipment, to ensure product quality.Hiner-Pack designs and manufactures products that provide a complete range of levels of electrostatic protection for IC chips, modules and wafers, as well as a safe and convenient mode of transportation.A variety of materials are available to meet customers' requirements of temperature resistant baking.
Established in Shenzhen, China, independent injection molding production line, one-stop service from mold research and development to product production, to meet the reasonable requirements of customers, the production of high-quality products in line with the requirements of the industry, professional packaging advice, to provide effective packaging for your products.
Years of industry precipitation, active research and development exploration, the factory has independently developed a variety of effective anti-static raw materials, color raw materials are also suitable for high standards and requirements of customers in the product, the diversity of raw materials development to adapt to the characteristics of various products provide an important guarantee.
Contact Person: Ms. Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
