CASES

Home / CASES

CASES

News

2025-09-19

The Path to Upgrading Tray Materials and Injection Molding Processes

Customer Overview M Company is an internationally leading IC manufacturing enterprise located in the Bavarian industrial region of Germany. With a long history of development, the company specializes in the development and innovation of chips and semiconductors. As a leader in the industry, the ...

2025-09-15

Enhancing the Warpage of JEDEC Trays to Exceed International Standards

In the storage and cross-border transportation of semiconductor components, the flatness of JEDEC Trays (JEDEC standard trays) directly determines the safety of chip storage and transportation. As a critical carrier connecting chip manufacturing and end-use applications, warpage deformation can lead ...

2024-07-15

Aluminum alloy mold and plastic injection molding combined process

Aluminum alloy material is the most commonly used material for making product molds in Hiner-pack, at the same time, it is also a kind of price and nature of stable characteristics. It has the following advantages: 1. low density and high strength: the density of aluminum alloy is only about one...

2022-06-24

Custom 160µm chip waffle box

In the process of production and research and development, Our company provides customized packaging solutions for many customers' chips. The pocket size designed this time is specifically corresponding to the IC size is only 14*0.21*0.1mm. Compared with the conventional chip size, 0.21mm is a very ...

2021-06-15

Designing Cheme Of Micro Components

Facing the changing environment and the changing of market demand, we would like to meet different difficulty challenge, day and night to meet customer demand for products, but also to the promotion of the company production capacity can provide customers with effective packing plan. In a way ...

sweet_34

Quick link

Home About us Products CASES News download Contact Us

Quick Contact

Address

Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN

Tel

86-0755-23229236-816

E-mail

Rainbowzhu@hiner-pack.com

sweet_34

Our Newsletter

Subscribe to our newsletter for discounts and more.

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

CASES

The Path to Upgrading Tray Materials and Injection Molding Processes

Enhancing the Warpage of JEDEC Trays to Exceed International Standards

Aluminum alloy mold and plastic injection molding combined process

Custom 160µm chip waffle box

Designing Cheme Of Micro Components