The Path to Upgrading Tray Materials and Injection Molding Processes

Customer Overview

    M Company is an internationally leading IC manufacturing enterprise located in the Bavarian industrial region of Germany. With a long history of development, the company specializes in the development and innovation of chips and semiconductors. As a leader in the industry, the company has achieved full automation of its SMT production line, uses equipment from multiple brands, and operates on a massive scale with a monthly production capacity of 5 million units. Its product standards, far exceeding those of its peers, have won the favor of major global enterprises. Over 70% of its products are sold to North America, Europe, and Japan, earning it a high reputation in the industry.

Project Background and Challenges

    At the SEMICON CHINA exhibition in Shanghai, our company secured a cooperation opportunity with M Company. The company had a batch of 500,000 chips that required packaging and needed to procure 5,000 JEDEC trays within three weeks. Upon receiving the order, our company immediately formulated a detailed production plan. First, we carefully evaluated the original samples provided by the customer and held a pre development meeting to discuss the following issues raised in the customer's test report:

    •Short tray reuse lifespan: The customer's original samples had insufficient damage resistance and could only be reused 3 to 5 times before experiencing varying degrees of deformation and surface wear.

   •Poor compatibility: Automated feeding machines from different brands required frequent parameter adjustments, affecting production line efficiency.

   •Risk of appearance damage: The raw materials specified by the customer developed irregular edges in the cavities after injection molding, easily causing micro scratches on the chip surface during transportation.

   •Outdated injection molding process: The tray's thermoplastic process was insufficient, leading to cracking after long term use.

These issues directly resulted in:

   •High packaging costs (frequent tray replacements)

   •Decreased production line efficiency (time consuming equipment adjustments)

   •Chip damage (friction induced damage)

Solution

   Upon receiving the requirements, we provided the customer with a combined solution of "standardization + customization":

   1.Material Upgrade

    •Selected a stable and high strength MPPO material available in the market

    •Can be repeatedly used in environments ranging from -20°C to 125°C (MAX 150°C)

    2.Structural Optimization

    •Warpage less than 0.50mm for long term stable use

    •Added guide angles and foolproof positioning holes for compatibility with equipment from multiple brands

   3.Process Improvement

    •Optimized mold design to strictly control product appearance

    •Upgraded injection molding process, significantly increasing and maintaining stable injection temperatures

    •Refined cooling process for more stable product reuse

Implementation Process

    •Requirement Confirmation: The customer provided chip packaging drawings and a list of automated equipment models.

    •Design Verification: We delivered 3D printed samples within 3 days for customer on machine testing.

    •Mold Manufacturing: Simultaneously initiated mold processing, completing trial molding after 20 days.

    •Small Batch Trial Production: Delivered 50 samples for production line verification.

    •Mass Delivery: After successful verification of the first sample, 5,000 trays were delivered on time.

    •After sales Tracking: Regularly inspected tray conditions and provided cleaning and maintenance recommendations.

Implementation Results

    After 3 months of actual operation, M Company reported the following results:

    •Reuse Lifespan: The number of tray reuse cycles increased to 4 to 7+ times, with consistently stable performance.

    •Equipment Compatibility: Automated feeding machines from multiple brands operated smoothly without parameter adjustments.

    •Appearance Yield Rate: The chip surface scratch rate decreased by 85%.

    •Cost Optimization: Packaging costs decreased by approximately 40%.

M Company's Evaluation

    "The durability of the new trays far exceeded expectations, and their compatibility was excellent, significantly reducing production line adjustment times. Your company's rapid response capability also won us the trust of our North American customers. Choosing Hiner Pack was undoubtedly a wise decision, and I am truly delighted with our mutually beneficial cooperation!"

Project Value Summary

    Through this project, we have gained a loyal major customer and accumulated valuable production experience. We have made significant progress from material selection to process optimization, significantly enhancing product stability and competitiveness. This has also established a higher technical and quality benchmark for our company in the industry. We will continue to deepen these achievements, continuously optimize our production system, and provide strong support for the smooth progress of subsequent projects and market expansion.