Products

Home / Products / Waffle Pack Chip Trays /

Heavy Duty Industrial Grid Waffle Trays for Fine Pitch IC Handling

Brand Name:	Hiner-pack
Model Number:	HN24233
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

50.7×50.7×4mm

Cavity Size:

1.2X0.5X0.5 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.26mm

Capacity:

17x25=425 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Heavy Duty Industrial Grid Waffle Trays for Fine Pitch IC Handling

Feature heavy duty industrial-grade grid structure to securely hold fine pitch ICs, preventing shifting and collision during handling and transportation. Built with durable materials to withstand frequent use in busy production lines, effectively reducing component damage and loss.

Deliver stable protection for sensitive electronic parts, shielding against impact and static risks. Maintain consistent performance in long-term industrial operations, supporting smooth workflow and minimizing downtime.

Support full customization of grid size, spacing and cavity depth to match diverse IC specifications. Adapt to various automated production lines and cleanroom standards, providing tailored solutions for semiconductor manufacturing needs.

Key Features/ Benefits

Reliable component protection
Durable industrial-grade material
Long-lasting durability
Customizable cavity layout
Precise waffle structure.

Specifications

Brand		Hiner-pack
Model		HN24233
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4mm
Cavity Size		1.2X0.5X0.5 mm
Matrix QTY		17x25=425 PCS
Warpage		MAX 0.26mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suitable for fine pitch IC storage, production line transfer, component testing and packaging. Work seamlessly with automated pick-and-place systems and industrial cleanroom environments. Ideal for both temporary placement and long-term safekeeping of delicate semiconductor chips.

Widely applied in semiconductor factories, IC packaging plants, electronic assembly workshops and component warehouses. Perfect for industrial production, inter-department transportation and high-precision component storage.

Packaging & Shipping/ Services

Packed in custom anti-static corrugated cartons with foam inserts to cushion against shocks and prevent surface scratches during long-distance transit. Each tray is wrapped in anti-static film to maintain ESD protection integrity.

Support stackable palletization for bulk shipments, optimizing logistics efficiency. Offer flexible shipping options including sea, air and express delivery, with tracking available for every order to ensure on-time, intact arrival.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Heavy Duty Industrial Grid Waffle Trays for Fine Pitch IC Handling

Heavy Duty Industrial Grid Waffle Trays for Fine Pitch IC Handling

ABS waffle pack trays

ABS Waffle Pack Chip Trays

Waffle Pack Chip Trays

ABS Standard Waffle Pack Chip Trays High Temperature Resistance For Small Components

Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die

ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging

Customizable Black Colourful ESD Waffle Pack Chip Trays For IC RF VR Chips

Tiny Modules 4 Inch Waffle Pack Chip Trays ESD Stable Anti Static