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Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavity Sizes for Semiconductor Packaging

Brand Name:	Hiner-pack
Model Number:	HN25023
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

322.6×135.9×8.12 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Flatness:

Less Than 0.76mm

Capacity:

2X36=72PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

JEDEC IC trays for semiconductors

dustproof JEDEC IC trays

durable semiconductor packaging trays

Product Description

Durable JEDEC IC Trays Protect Semiconductors and Reduce Dust in Packaging

Offer robust structural integrity to prevent IC shifting, scratches, and contamination. Built with heat-resistant MPPO material to withstand up to 150°C for stable industrial performance. Meet JEDEC standards for consistent reliability. Seeking durable trays for secure IC handling?

Integrate seamlessly with automated packaging lines and logistics workflows. Perform steadily in loading, transfer, and high-temperature processing procedures. Adapt smoothly to diverse semiconductor packaging and shipping scenarios.

Support fully customized cavity sizes and grid layouts to match specific IC dimensions. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect ICs throughout transit.

Key Features/ Benefits

Deliver durable construction.
Reduce dust contamination.
Support small batch production in the first batch.
More than 12 years of export experience.
With professional engineers and efficient management.

Specifications

Brand		Hiner-pack
Model		HN25023
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×8.12 mm
Cavity Size		48.51×4.04×0.84 mm
Matrix QTY		2X36=72 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Serve semiconductor IC packaging, high-temperature assembly, cleanroom processing, and component storage operations. Compatible with automated handling systems, Class 100/1000 cleanrooms, and high-precision manufacturing lines.

Also utilized in inter-factory IC transfer, overseas logistics shipping, and finished component warehousing. Cater to IC manufacturers, packaging houses, and electronic component logistics providers.

Packaging & Shipping/ Services

Provide tailored solutions for IC packaging and transportation. Adjust cavity size, pitch, and layout to fit diverse IC dimensions for secure loading and transit. Leverage heat-resistant MPPO material to withstand 150°C processes. Ensure stable performance during long-distance shipping and automated packaging operations.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavity Sizes for Semiconductor Packaging

Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavity Sizes for Semiconductor Packaging

JEDEC IC trays for semiconductors

dustproof JEDEC IC trays

durable semiconductor packaging trays

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