Products

Home / Products / Waffle Pack Chip Trays /

Waffle Pack Chip Trays made from anti static materials to ensure safe handling and storage of delicate semiconductor IC chips

Brand Name:	Hiner-pack
Model Number:	HN25007
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

50.7×50.7×4 Mm

Cavity Size:

6.7X3.1X0.5 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.22mm

Capacity:

5x10=50 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Anti-Static Waffle Trays for Secure Storage of Delicate Semiconductor IC Chips

Equipped with independent recessed pockets to hold electronic components separately. Cut down shifting, friction and surface damage throughout testing, handling and storage processes.

Maintain stable conductive properties to eliminate static threats. Adapt to continuous repeated operation inside electronics manufacturing environments.

Allow adjustments to pocket dimensions and overall outlines. Deliver targeted storage solutions to match different production and logistics requirements from electronics industries.

Key Features/ Benefits

Stable conductive ESD performance
Independent separated pockets
Durable construction
Secure chip holding
Support custom specifications
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN25007
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4 mm
Cavity Size		6.7X3.1X0.5 mm
Matrix QTY		5x10=50 PCS
Warpage		MAX 0.22mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Ideal for storing and transporting semiconductor devices and electronic components. Separate pocket design effectively avoids collision and electrostatic damage.

Suitable for semiconductor factories, electronics assembly plants and component distributors for testing, production transfer and inventory management.

Customized Services

Customization service is available to satisfy varied industrial requirements. Pocket dimensions and overall sizes can be developed as requests. Professional technical team supports project cooperation. Reach out to discuss tailored solutions for your production lines.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Waffle Pack Chip Trays made from anti static materials to ensure safe handling and storage of delicate semiconductor IC chips

Waffle Pack Chip Trays made from anti static materials to ensure safe handling and storage of delicate semiconductor IC chips

ABS waffle pack trays

ABS Waffle Pack Chip Trays

Waffle Pack Chip Trays

ABS Standard Waffle Pack Chip Trays High Temperature Resistance For Small Components

Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die

ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging

Customizable Black Colourful ESD Waffle Pack Chip Trays For IC RF VR Chips

Tiny Modules 4 Inch Waffle Pack Chip Trays ESD Stable Anti Static