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Durable JEDEC IC Trays for Wafer Safety and Clean Environments

Durable JEDEC IC Trays for Wafer Safety and Clean Environments

Brand Name: Hiner-pack
Model Number: HN25015
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Black
Quality Assurance:
Delivery Guarantee, Reliable Quality
Cavity Size:
322.6×135.9×8.35 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Flatness:
Less Than 0.76mm
Capacity:
12X6=72 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Product Description
Durable JEDEC IC Trays for Wafer Safety and Clean Environments
Shield delicate semiconductor wafers in clean production environments. Provide reliable structural integrity to prevent component damage. Resist high temperatures up to 130°C for stable industrial performance. Seeking trusted tray solutions for secure wafer handling?

Fit automated production lines and cleanroom operations perfectly. Perform steadily in wafer transfer and storage procedures. Adapt to diverse semiconductor manufacturing workflows smoothly.

 Support fully customized cavity sizes and layout designs. Comply with industry standards for clean production. Deliver tailored solutions that meet unique semiconductor manufacturing requirements.
Key Features/ Benefits 
  • Sturdy structural integrity
  • Effective dust prevention
  • Clean production compatibility
  • Reliable wafer protection
  • Custom cavity & layout design
Specifications
Brand Hiner-pack
Model HN25015
Material PPE
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×8.35 mm
Cavity Size 13×20.5×1.26 mm
Matrix QTY 12X6=72 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Serve semiconductor wafer handling, high-temperature assembly, cleanroom production, and component storage operations. Adapt to automated manufacturing lines, cleanroom Class 100/1000 environments, and precision assembly system

Also utilized in inter-factory wafer transfer, third-party testing services, and finished device inventory management. Cater to integrated device manufacturers, semiconductor foundries, and clean production facilities.
Customized Services
Provide tailored customization for JEDEC IC trays. Work closely with clients to define cavity pitch, pocket depth, and structural reinforcements for specific wafer types. Develop high-temperature resistant PPE material variants to meet 130°C process needs. Validate prototypes through vibration and temperature cycling tests, delivering personalized tray solutions that enhance clean production efficiency and protect wafers throughout manufacturing.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers