|
Product Details:
|
| Material: | ABS.PC.PPE.MPPO...etc | Color: | Black.Red.Yellow.Green.White..etc |
|---|---|---|---|
| Property: | ESD,Non-ESD | Design: | Standard And Non-standard |
| Size: | All Kinds Of | Surface Resistance: | 1.0x10E4~1.0x10E11Ω |
| Clean Class: | General And Ultrasonic Cleaning | Incoterms: | EXW,FOB,CIF,DDU,DDP |
| Injection Mold: | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times | Molding Method: | Injection Moulding |
| High Light: | 400PCS IC Chip Tray,ISO9001 IC Chip Tray,400PCS Electronic Components Tray |
||
Custom Size Black IC Chip Tray 400PCS For Packaging Electronic Components
Manufacturer Designs Custom IC Trays For Packaging Electronic Components
Hiner-pack has leading mould processing and injection molding equipment,high level dustless cleaning devices and a variety of testing equipment.Meanwhile,Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as researching institutions.Hiner-pack has mastered special process technique and manufacturing in semiconductor packaging raw material field.Owned a lot of inventions and practical new patents.Through years of unremitting efforts,Hiner-pack has a professional R&D team to improve semiconductor packaging products,constantly launch new products,and solve the customers’ demand for high quality products.
Advantages
1. Light weight, saving transportation and packaging costs;
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine;
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the most dozen capacity design, cost saving;
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement
Ref Detail
| Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
| Model | 30*30-10 | Package Type | IC Die |
| Cavity Size | 0.76*0.76*0.254mm | Matrix QTY | 20*20=400PCS |
| Material | ABS | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
| Usage | Packaging of Electronic Components,Optical device, |
| Feature | ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly |
| Material | MPPO.PPE.ABS.PEI.IDP...etc |
| Color | Black.Red.Yellow.Green.White and custom color |
| Size | Customized size, rectangle,circle shape |
| Mold type | Injection Mold |
| Design | Original sample or we can create the designs |
| Packing | By Carton |
| Sample | Sample time: after draft confirmed and payment arranged |
| Sample charge: 1. Free for stock samples | |
| 2. Custom Tray negotiated | |
| Lead Time | 5-7 Working days |
| The exact time should according to the ordered quantity |
FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize
the project depending on the specific time
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
