Product Details:
|
Material: | ABS | Color: | Black |
---|---|---|---|
Property: | ESD | Design: | Standard |
Size: | 3 Inch | Surface Resistance: | 1.0x10E4~1.0x10E11Ω |
Clean Class: | General And Ultrasonic Cleaning | Incoterms: | EXW,FOB,CIF,DDU,DDP |
Injection Mold: | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times | Molding Method: | Injection Moulding |
Highlight: | impact resistance IC Tray,Injection Moulding IC Tray,ESD waffle pack tray |
Anti Static Waffle Pack IC Tray Storing IC Components Impact Resistance
Waffle Pack With Excellent Anti-Static Properties Is Used For Storing IC Components
The Waffle Pack is an ideal tray for storing tiny electronic components because the tray is permanently antistatic. When used, it has good mechanical strength and heat resistance, good impact resistance, strong chemical corrosion resistance, and will not affect the use of its anti-static performance due to the change of environment, time and temperature.
The use of Waffle Pack to store electronic components or IC can effectively avoid short circuit phenomenon. Because the product is prone to friction in the storage and transportation process, if there is no anti-static performance, it will affect the quality of the product, and may even cause damage.
Because the anti-static tray can effectively release the static charge accumulated on the surface of the object, so that it will not produce charge accumulation and high potential difference, so it can improve the damage rate of the product in the production process and transportation, reduce the product cost and improve the quality and profit of the product
Character Reference
Material: ABS
Thickness:4mm
Appearance: black
Customized: width and length, thickness as customer request
Conductive: 10e4-10e6 ohms
Anti-static: 1.0*10e4-1.0*10e11 ohms
Detail Reference
Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
Model | HN2072 | Package Type | Die |
Cavity Size | 4.3*2*0.15 mm | Matrix QTY | 13*7=91PCS |
Material | ABS | Flatness | MAX 0.2mm |
Color | Black | Service | Accept OEM,ODM |
Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
Outline Size | Material | Surface Resistance | Service | Flatness | Color |
2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
Provide professional design and packaging for your products |
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging Details:Packing according to customer's specified size
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455