Brief: Discover the 4-inch ABS MPPO Waffle Pack Bare Die Tray, designed for 36 PCS optical device packaging. This high-quality tray offers customizable layouts, depths, and cavity counts to meet demanding semiconductor transport needs. Perfect for wafer dies, chips, and PCBA modules, it ensures superior protection and convenience for storage and transportation.
Related Product Features:
Customizable layout, depth, and cavity count to meet specific semiconductor transport requirements.
Made from high-quality ABS material, ensuring durability and protection for delicate components.
Features a 36-cavity design (6x6 matrix) with each cavity sized at 13x13mm for small chips.
Offers excellent flatness with a maximum deviation of 0.3mm for precise component placement.
Reusable and environmentally friendly, with materials that can be fully degraded after disposal.
Compatible with accessories like covers, clips, and Tyvek paper for complete packaging solutions.
Provides comprehensive OEM and ODM services, including design, production, and packaging.
Backed by 12 years of experience in OEM for USA and EU customers, ensuring high-quality standards.
Faqs:
Can you do OEM and customized design IC trays?
Yes, we have strong mold manufacturing and product design capabilities, with extensive experience in mass-producing various IC trays.
How long is your delivery time?
Delivery typically takes 5-8 working days, depending on the order quantity and specific requirements.
Do you provide samples? Is it free or extra?
Yes, we offer samples. Depending on the product value, samples may be free or charged, with shipping costs typically collected or as agreed.
What kind of Incoterms can you support?
We support various Incoterms, including Ex Works, FOB, CNF, CIF, CFR, DDU, DAP, and others as agreed.
What shipping methods do you offer?
We ship by sea, air, express, or mail post, depending on the order quantity and volume.