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4 inch size waffle box Wafer Tray Chip Tray series product display

Sample Assembly Test
January 11, 2022
Category Connection: Waffle Pack Chip Trays
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Tags:
#ABS waffle pack trays #ABS Waffle Pack Chip Trays #Waffle Pack Chip Trays
Brief: Discover our 4-inch ABS MPPO Waffle Pack Bare Die Tray, designed for 36 PCS optical device packaging. Perfect for semiconductor transport, this tray offers customizable layout, depth, and cavity count for optimal protection and convenience.
Related Product Features:
  • Customizable layout, depth, and cavity count to meet specific semiconductor transport needs.
  • Made from high-quality ABS material for durability and reusability.
  • Designed to protect small chips or components less than 13mm in size.
  • Compatible with accessories like covers, clips, and Tyvek paper for complete packaging.
  • Reusable and environmentally friendly, with fully degradable plastic options.
  • Offers flexible OEM services, including custom designs and materials like MPPO, PPE, and PEI.
  • Features a flatness of MAX 0.3mm for precise component placement.
  • Backed by 12 years of OEM experience for USA and EU customers.
Faqs:
  • Can you do OEM and customized design IC trays?
    Yes, we have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
  • How long is your delivery time?
    Delivery typically takes 5-8 working days, depending on the order quantity.
  • Do you provide samples? Is it free or extra?
    Yes, we offer samples which may be free or charged based on product value, with shipping costs typically collected or as agreed.
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