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ABS Black Waffle Pack Chip Trays

China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund


—— 本間宏紀

이것은 귀 회사와의 두 번째 합작입니다.상품 가격 너무 좋아요.다시 올게요, 다음번 합작을 기대합니다!

—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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ABS Black Waffle Pack Chip Trays

ABS Black Waffle Pack Chip Trays
ABS Black Waffle Pack Chip Trays ABS Black Waffle Pack Chip Trays ABS Black Waffle Pack Chip Trays ABS Black Waffle Pack Chip Trays

Large Image :  ABS Black Waffle Pack Chip Trays

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: Outline Size 2inch 3Inch 4Inch
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: 4500~5000PCS/per day

ABS Black Waffle Pack Chip Trays

Material: ABS.PC.MPPO...etc Color: Black.Red.Yellow.Green.White..etc
Temperature: General 80°C~100°C Property: ESD,Non-ESD
Surface Resistance: 1.0x10E4~1.0x10E11Ω Warpage: Less Than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Customized Service: Suitable For All Kinds Of Bar.Die.Chip Devices Or Parts Injection Mold: Customized Case Need(Lead Time 20~25Days,Mold Life Span: 450,000 Times.)
High Light:

Waffle Pack Chip Trays


ABS Waffle Pack Chip Trays


ABS waffle pack trays

ABS Black Waffle Pack Chip Trays
Square Regular Antistatic ABS Waffle Pack With Different Cavity Can Be Designed For IC Chips


Waffle Pack is a form of packaging designed for use with parts that are either very small or unusual in shape. Waffle pack are embossed or pocketed trays, typically made of plastic, that resemble a breakfast waffle (hence the name). The waffle packs are loaded using pick and place equipment so that the "inside" of each pocket contains a part or component. Once loaded - the parts are covered with anti-static paper, and then a foam-covered crown holds the parts in place, and finally, a lid secures the waffle package together.


As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized,Provide one-stop service from design to production to packaging.


Product features


1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transfer or loading samples for testing
3. Stable anti-static performance, good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. It can be matched with the cover and clips of the same series, convenient to meet all kinds of shipping methods
6. Recycling, plastic material is easy to degrade after waste, no environmental concerns
7. It can be stack-able and can also ensure the design of maximum utilization of tray matrix


Product Application


Wafer Die / Bar / Chips                 PCBA module component
Electronic component packaging  Optical device packaging


Packaging Details:Packing according to customer's specified size




1. More than 10 years export experience

2. With professional engineers and efficient management

3. Short delivery time and good quality

4. Support small batch production in the first batch

5. Professional sales within 24 hours efficient reply

6. Factory has ISO certification, and the products comply to RoHS standard.

7. Our products are exported to the United States, Germany, UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, service or cost performance has been well recognized

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

ABS Black Waffle Pack Chip Trays 0



Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

Die Place On The Waffle Pack
ABS Black Waffle Pack Chip Trays 1
ABS Black Waffle Pack Chip Trays 2

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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