|Standard And Non-standard
|General And Ultrasonic Cleaning
Waterproof Waffle Pack Chip Trays,
49PCS Waffle Pack Chip Trays,
ESD waffle tray
ABS Standard Waffle Pack Chip Trays Waterproof High Temperature Resistance
ABS Standard Waffle Pack Black Color With Waterproof High Temperature Resistance Function
When your product is not the shape of the specifications or height, we recommend that you customize a completely meet your component tray, reduce the spacing between the matrix and is convenient to pick up, in a tray design to maximize storage quantity, not only can safely place your components, also use more affordable data to complete the product design requirements.
A chip tray is a carrier for micro-components or wafer die that are used to transport and transfer products.Therefore, the pocket size in all chip trays is designed according to the dimensions and specifications of specific components. Customization is the most suitable and perfect packaging solution.
HN 21014-2 Detail Information:
As for HN2014-2,Usually used for loading small chips or components less than 10.5mm, the matrix quantity is 7*7=49PCS per tray, carrying a large number of chips in a small volume. At the same time, the purchase of inch products can match the corresponding accessories such as cover, clip and Tyvek paper of the existing series, and the complete package is more easy to the transfer, transport and storage of the products.
|Outline Line Size
1. More than 10 years export experience
2. With professional engineers and efficient management
3. Short delivery time and good quality
4. Support small batch production in the first batch
5. Professional sales within 24 hours efficient reply
6. Factory has ISO certification, and the products comply to RoHS standard.
7. Our products are exported to the United States, Germany, UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, service or cost performance has been well recognized
|ABS / PC / MPPO / PPE... acceptable
|Can be customized
|A. The free samples: choosen from existing products.
|B. customized samples as per your design/demand
|Carton or as per customer's request
|Usually 8-10 working days,depends on order quantity
|Term of payment
Mold:50% T/T deposit, 50% balance after sample confirmatio
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging Details:Packing according to customer's specified size
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Contact Person: Rainbow Zhu
Tel: 86 15712074114