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ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging

Certification
China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

—— 本間宏紀

이것은 귀 회사와의 두 번째 합작입니다.상품 가격 너무 좋아요.다시 올게요, 다음번 합작을 기대합니다!

—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging

ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging
ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging
ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging

Large Image :  ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: 4Inch
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: 4500~5000PCS/per day

ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging

Description
Material: ABS.PC.MPPO...etc Color: Black.Red.Yellow.Green.White..etc
Temperature: General 80°C~100°C Property: ESD,Non-ESD
Surface Resistance: 1.0x10E4~1.0x10E11Ω Warpage: Less Than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Customized Service: Suitable For All Kinds Of Bar.Die.Chip Devices Or Parts Injection Mold: Customized Case Need(Lead Time 20~25Days,Mold Life Span: 450,000 Times.)
High Light:

Waffle Pack Bare Die Tray

,

MPPO Bare Die Tray

,

Bare Die waffle tray

ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging

 

High Quality ABS Waffle Pack Based Internation Standard For Bare Wafer

 

In order to better protect the components or chips, choosing injection trays for packaging has become an alternative and option packaging solution. It can not only provide comprehensive protection for components, but also provide excellent products in terms of storage and transportation. Great advantage of convenience. At the same time, due to the reusable characteristics of plastic pallets, the products we produce can also be reused, and the waste of plastic after disposal can also be fully degraded, thereby eliminating some of the problems that need to be dealt with by environmental protection. Our company can Provide one-stop service from design to production to packaging, solve all the problems faced by packaging for your parts, choose high-quality professional suppliers, and reduce unnecessary after-sales troubles for you.

 

Waffle pack opening procedure discrete devices packaged in Waffle Packs normally have room to move around within the pocket. Sometimes parts may stick to the paper insert usually placed between the top of the package and the lid. Parts can easily jump out of an open package subject to small vibrations, static charge or strong airflow. Smaller parts are more susceptible to jumping out of, or being blown out of, the pockets of an open waffle pack.

 

HN21014-2 Detail Information:

 

As for HN2038,Usually used for loading small chips or components less than 13mm, carrying a large number of chips in a small volume. At the same time, the purchase of inch products can match the corresponding accessories such as cover, clip and Tyvek paper of the existing series, and the complete package is more easy to the transfer, transport and storage of the products.

Outline Line Size 101.57*101.57*3mm Brand Hiner-pack
Model HN21014-2 Package Type IC Parts
Cavity Size 13*13mm Matrix QTY 6*6=36PCS
Material ABS Flatness MAX 0.3mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS


 

Product Application

 

Wafer Die / Bar / Chips                       PCBA module component 
Electronic component packaging       Optical device packaging

 


Packaging


Packaging Details:Packing according to customer's specified size

 

Our Advantages

 

1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years’ex perience of OEM for USA and EU customers.

6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging 0

FAQ

 

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging 1

ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging 2

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

Send your inquiry directly to us (0 / 3000)