|Surface Resistance:||1.0x10E4~1.0x10E11Ω||Flatness:||Less Than 0.76mm|
|Clean Class:||General And Ultrasonic Cleaning||Incoterms:||EXW,FOB,CIF,DDU,DDP|
|Customized Service:||Support Standard And Non-standard,precision Machining||Injection Mold:||Customized Case Need(Lead Time 25~30Days,Mold Life Span: 300,000 Times.)|
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Custom High Temperature Resistance Black JEDEC Tray For IC Device Storage
The JEDEC tray is a kind of plastic products, which is also known as the electronic chip tray. It is a packaging plastic tray used by semiconductor packaging and testing companies for their chip (IC) packaging and testing, which can prevent electrostatic contact of the product and facilitate automatic detection and installation. It can store multiple products at the same time, and can be stacked with multiple layers. The tray can prevent the product from disconnecting even if it bends during use due to the characteristics of the tray.
The Details of the HN22050 JEDEC Tray
The HN22050 tray is made of PES and the raw material is selected based on the highest temperature rate. Trays designed for components that require exposure to high temperatures have a temperature resistance of typically 150°C or higher. It is molded into a rectangular standard shape and contains a uniform matrix of 5*11. The pockets hold the components and provide protection during transport and handling.
In addition, the spacing between tray slots provides accurate component positions for standard industrial automated assembly equipment. The packaging and transportation of tray is in the form of a combination of single tray, and then stacked and bundled together. An empty tray is placed on the tray where the components are loaded and stacked together. The general tray stacking structure is five full trays and one empty cover tray (5+1), ten full trays and one empty cover tray (10+1).
|Outline Line Size||322.6*135.9*12.19mm||Brand||Hiner-pack|
|Cavity Size||17.3*17.3*4.9||Matrix QTY||5*11=55PCS|
|Color||Black||Place of origin||CHINA|
Application of the HN22050 Matrix Tray
Test and Measurement Technology Mechanical and Electrical Equipment
Power Supply Electronic Component
|Bake Temperature||Surface Resistance|
|PPE||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Carbon Fiber||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Carbon Powder||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Glass Fiber||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|PEI+Carbon Fiber||Max 180°C||1.0*10E4Ω~1.0*10E11Ω|
|Color, temperature and other special requirements can be customized|
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4.After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.
Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.
Q4: How about batch order production?
Ans: Normally 5-8 days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.
Contact Person: Rainbow Zhu
Tel: 86 15712074114