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ESD Safe JEDEC Tray with High Precision and 132 PCS Capacity for IC Testing & Packaging

ESD Safe JEDEC Tray with High Precision and 132 PCS Capacity for IC Testing & Packaging

Brand Name: Hiner-pack
Model Number: HN24221
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Usually Black Or Dark Gray For ESD Protection
Quality Assurance:
Delivery Guarantee, Reliable Quality
Cavity Size:
19.0x6.0x2.2 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Flatness:
Less Than 0.76mm
Capacity:
11x12=132 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Highlight:

ESD safe JEDEC IC tray

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JEDEC tray for IC testing

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IC packaging JEDEC tray

Product Description
ESD Safe JEDEC Tray for IC Testing & Packaging 
This JEDEC tray is specifically designed for static-sensitive semiconductor devices, ensuring safe handling, storage, and transportation throughout the manufacturing process.

Manufactured with high-performance conductive MPPO material, this tray provides stable ESD protection and dimensional accuracy, making it ideal for automated assembly and testing environments.

Key Features/ Benefits 
  • Prevents damage to sensitive IC components during handling
  • JEDEC Standard Compatibility
  • High Precision & Low Warpage
  • Strong & Durable Structure
  • OEM / ODM support for different IC packages
Specifications
Brand Hiner-pack
Model  HN24221
Material  MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 19.0x6.0x2.2 mm
Matrix QTY 11x12=132 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
  • FBGA / BGA / QFN / SOP IC packaging
  • Semiconductor assembly & testing
  • Cleanroom handling environments
  • IC shipping & logistics
  • Automated production lines
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Professional engineering team
  • Stable supply for global semiconductor customers