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Custom JEDEC Tray with High Precision and Reusable Design for IC and Semiconductor Packaging

Custom JEDEC Tray with High Precision and Reusable Design for IC and Semiconductor Packaging

Brand Name: Hiner-pack
Model Number: HN24223
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Usually Black Or Dark Gray For ESD Protection
Quality Assurance:
Delivery Guarantee, Reliable Quality
Cavity Size:
3x3x0.92 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Flatness:
Less Than 0.76mm
Capacity:
14x35=490 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Highlight:

Custom JEDEC IC trays

,

JEDEC Tray for MEMS

,

SiP compatible JEDEC trays

Product Description
Custom JEDEC Tray Manufacturer for IC / SiP / MEMS 
We provide custom JEDEC tray solutions for advanced semiconductor packaging, including SiP, MEMS and complex IC modules.
Key Features/ Benefits 
  • Full customization based on chip drawing
  • High precision cavity for complex IC structures
  • Multiple material options (PEI / MPPO / PPE)
  • Fast mold development
Specifications
Brand Hiner-pack
Model  HN24223
Material  MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 3x3x0.92 mm
Matrix QTY 14x35=490 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
  • SiP packaging
  • MEMS devices
  • Advanced semiconductor modules
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Professional engineering team
  • Stable supply for global semiconductor customers