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Automotive JEDEC IC Tray for ECU Power Modules - Heat Resistant 180°C, Impact Resistant, High Durability

Name: Automotive JEDEC IC Tray for ECU Power Modules - Heat Resistant 180°C, Impact Resistant, High Durability
Brand: Shenzhen Hiner Technology Co., Ltd.
SKU: HN24226
Price: 1.35 USD
Availability: InStock

Brand Name:	Hiner-pack
Model Number:	HN24226
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Usually Black Or Dark Gray For ESD Protection

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

44.5x41.5 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Flatness:

Less Than 0.76mm

Capacity:

2x6=12 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

JEDEC Tray for ECU modules

Automotive IC storage tray

Power module JEDEC tray

Product Description

Automotive JEDEC Tray for ECU Power Modules

Designed for automotive semiconductor applications, meeting strict reliability standards.

Key Features/ Benefits

High durability for automotive use
Heat resistant up to 180°C
Long lifecycle
Impact resistant

Specifications

Brand		Hiner-pack
Model		HN24226
Material		PPE
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×10.6 mm
Cavity Size		44.5x41.5 mm
Matrix QTY		2x6=12 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices

Automotive MCU
ECU systems
Power IC modules

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Automotive project experience
In-house mold design capability
Fast prototype development
Strict material control
Stable supply for global semiconductor customers

Tags:

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Quick Contact

Address

Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN

Tel

86-0755-23229236-816

E-mail

Rainbowzhu@hiner-pack.com

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Automotive JEDEC IC Tray for ECU Power Modules - Heat Resistant 180°C, Impact Resistant, High Durability

Automotive JEDEC IC Tray for ECU Power Modules - Heat Resistant 180°C, Impact Resistant, High Durability

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