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High Precision JEDEC Tray for Fine Pitch IC

Brand Name:	Hiner-pack
Model Number:	HN24239
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Usually Black Or Dark Gray For ESD Protection

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

14x22x1.96 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Flatness:

Less Than 0.76mm

Capacity:

6x11=66 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

ESD safe JEDEC IC tray

fine pitch IC storage tray

automation compatible JEDEC tray

Product Description

High Precision JEDEC Tray for Fine Pitch IC

Need a reliable carrier for your delicate fine pitch ICs? Our JEDEC trays are engineered for maximum protection and performance in semiconductor manufacturing.

When your ICs require precise positioning or have non-standard dimensions, we recommend a fully customized JEDEC tray tailored to your components. Our custom pocket designs optimize cavity spacing for smooth automated pick-and-place, maximize storage capacity per tray, and ensure your fine pitch ICs are securely held throughout production. This solution not only safeguards your sensitive semiconductors but also meets your packaging requirements with cost-effective, high-precision manufacturing.

A JEDEC tray is a critical carrier for fine pitch ICs, semiconductors, and electronic components, used for automated handling, inspection, transport, and long-term storage. Therefore, every pocket in our trays is precision-machined to match the exact dimensions of your specific ICs. ESD-safe material and strict flatness control ensure electrostatic protection and stable positioning, making customization the ideal packaging solution for high-precision semiconductor applications.

Key Features/ Benefits

High precision cavities for fine pitch IC (≤0.5 mm)
ESD safe with surface resistance 1E4–1E11 Ω
Compatible with automation handling systems
Fully customizable pockets
Durable material for long lifecycle

Specifications

Brand		Hiner-pack
Model		HN24239
Material		ABS
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		14x22x1.96 mm
Matrix QTY		6x11=66 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices

Fine pitch IC packaging (QFN, BGA, CSP)
Automated pick-and-place systems
Semiconductor inspection & testing
IC logistics and storage

Packaging & Shipping/ Services

Our high-precision JEDEC trays are packaged in durable, ESD-safe anti-static materials with secure interlocking stacking design and shock-absorbing cushioning inserts, ensuring maximum protection against physical damage, electrostatic discharge, and contamination during transit and storage.

All shipments are fully tracked and handled by trusted global logistics carriers, ensuring reliable, on-time worldwide delivery to your facility. We provide flexible shipping options to meet your urgent production needs, including expedited shipping for rush orders, and comprehensive shipping documentation to streamline customs clearance for international orders.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

High Precision JEDEC Tray for Fine Pitch IC

High Precision JEDEC Tray for Fine Pitch IC

ESD safe JEDEC IC tray

fine pitch IC storage tray

automation compatible JEDEC tray

IC esd tray

Temperature JEDEC IC Trays

ESD JEDEC IC Trays

Hiner Pack Standard Colorfully JEDEC IC Trays For Micro Components

ISO 9001 Heat Proof JEDEC IC Trays Protect Chip ESD PPE MPPO Standard

Regular Size Colorful Antistatic Shipping Trays Thermostable For IC Component

Heat Resistant Anti-Static JEDEC IC Trays Electronic Components Tray

PPE MPPO Anti-static Standard JEDEC Tray Avoiding Manual Picking