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High Precision ESD Safe JEDEC Tray for Fine Pitch IC with Automation Compatibility

Brand Name:	Hiner-pack
Model Number:	HN24239
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Usually Black Or Dark Gray For ESD Protection

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

14x22x1.96 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Flatness:

Less Than 0.76mm

Capacity:

6x11=66 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

ESD safe JEDEC IC tray

fine pitch IC storage tray

automation compatible JEDEC tray

Product Description

High Precision JEDEC Tray for Fine Pitch IC

This JEDEC tray is designed for delicate, fine pitch ICs, ensuring stable positioning during automated pick-and-place, inspection, and transport. Its high-precision cavity minimizes chip movement and reduces defects.

Key Features/ Benefits

High precision cavities for fine pitch IC (≤0.5 mm)
ESD safe with surface resistance 1E4–1E11 Ω
Compatible with automation handling systems
Custom pockets available for various IC types
Durable material for long lifecycle

Specifications

Brand		Hiner-pack
Model		HN24239
Material		ABS
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		14x22x1.96 mm
Matrix QTY		6x11=66 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices

Fine pitch IC packaging (QFN, BGA, CSP)
Automated pick-and-place systems
Semiconductor inspection & testing
IC logistics and storage

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:

Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

High Precision ESD Safe JEDEC Tray for Fine Pitch IC with Automation Compatibility

High Precision ESD Safe JEDEC Tray for Fine Pitch IC with Automation Compatibility

ESD safe JEDEC IC tray

fine pitch IC storage tray

automation compatible JEDEC tray

IC esd tray

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ESD JEDEC IC Trays

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