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High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution Prevention

High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution Prevention

Brand Name: Hiner-pack
Model Number: HN24136
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Black
Quality Assurance:
Delivery Guarantee, Reliable Quality
Outline Line Size:
50.7×50.7×7.4 Mm
Cavity Size:
3.00x0.70x0.30 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Warpage:
Warpage MAX 0.3mm
Capacity:
9x19=171 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Product Description
High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution Prevention

High-Precision Cleanroom Waffle Trays meet strict cleanroom industry standards. Trays deliver excellent contamination control performance, and offer safe stable handling for delicate precision IC chips.


High-Precision Cleanroom Waffle Trays own compact precise grid structure. Trays effectively prevent dust pollution damage, and perfectly fit semiconductor manufacturing and testing processes.


High-Precision Cleanroom Waffle Trays support customized cavity designs. Trays protect fragile fine pitch chips well, and ensure stable reliable use in cleanroom logistics and storage.

Key Features/ Benefits 
  • Anti-static & dust-proof design for safe chip handling
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Cleanroom-grade contamination control to protect sensitive ICs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24136
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 3.00x0.70x0.30 mm
Matrix QTY 9x19=171 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Cleanroom-Grade Waffle Pack Chip Trays deliver reliable IC protection through the whole semiconductor manufacturing and transportation process. Trays feature great contamination control performance, ESD anti-static protection, and fully protect delicate fine pitch chip devices.

Trays are widely applied to fine pitch IC packaging (QFN, BGA, CSP bare die), JEDEC compatible automated pick-and-place production lines, semiconductor inspection & testing procedures, as well as cleanroom IC logistics transportation and daily storage management.
Customized Services
Cleanroom-Grade Waffle Pack Chip Trays support fully customized cavity sizes and layout designs. Trays adopt cleanroom-grade dust-free anti-static material, with stable stacking structure to avoid contamination damage during transit.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers