From March 20 to March 22, 2024, Shanghai New International Expo Center gathered semiconductor equipment, materials, manufacturing companies from many countries and regions around the world, displaying advanced products and technologies and innovative solutions, Hiner-pack brought a series of self-developed achievements to the exhibition, including Jedec IC Trays, Jedec Matrix Trays, IC Chip Tray, Gel Sticky Box and Wafer Shipping Box series.
On the first day of the exhibition, Hiner-pack attracted customers and partners from all over the world to communicate, consult and negotiate cooperation, the scene atmosphere is warm.Hiner-pack's booth was full of hot scenes of harmonious conversation, colorful product display dazzled people, and the excellent display effect made the customers deeply feel Glabra's brand strength and craftsmanship quality!
Hiner-pack's semiconductor packaging product development and production strength deeply trusted by customers, especially the ability to independently develop bearing molds favored by customers, conveying the development potential of Hiner-pack innovation and breakthroughs, but also a sign of Glory Light in the future semiconductor packaging industry will usher in a higher-quality growth. Reliable smart show, clients are welcome to visit our factory!
Contact Person: Ms. Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
