Send Message
Home ProductsElectronic Components Tray

ESD Waffle Pack Electronic Components Tray

China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund


—— 本間宏紀

이것은 귀 회사와의 두 번째 합작입니다.상품 가격 너무 좋아요.다시 올게요, 다음번 합작을 기대합니다!

—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

I'm Online Chat Now

ESD Waffle Pack Electronic Components Tray

ESD Waffle Pack Electronic Components Tray
ESD Waffle Pack Electronic Components Tray ESD Waffle Pack Electronic Components Tray ESD Waffle Pack Electronic Components Tray ESD Waffle Pack Electronic Components Tray

Large Image :  ESD Waffle Pack Electronic Components Tray

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: To meet all kinds of custom needs of customers
Payment & Shipping Terms:
Minimum Order Quantity: 500PCS(Low this QTY will charge machine-operating and injection fee)
Price: 0.25~0.55usd/pcs
Packaging Details: It depends on the QTY of order and size of product
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day

ESD Waffle Pack Electronic Components Tray

Material: ABS.PC.PPE.MPPO...etc Color: Black.Red.Yellow.Green.White..etc
Property: ESD,Non-ESD Design: Standard And Non-standard
Size: All Kinds Of Surface Resistance: 1.0x10E4~1.0x10E11Ω
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Injection Mold: Lead Time 20~25Days,Mold Life Span: 30~450,000 Times Molding Method: Injection Moulding
High Light:

ESD Waffle Electronic Components Tray


SGS Electronic Components Tray


sgs ESD electronic tray

ESD Waffle Pack Electronic Components Tray
Durable Antistatic ABS Non-Standard Waffle Pack With Different Size Can Be Customized For Optoelectronic Components
As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized,Provide one-stop service from design to production to packaging.

Chip tray is a carrier for bare dies used for the transportation and handling of a small batch of dies. A waffle pack is typically a plastic tray with pockets sized up for a particular die size.
IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).

1. More than 10 years export experience
2. With professional engineers and efficient management
3. Short delivery time and good quality
4. Support small batch production in the first batch
5. Professional sales within 24 hours efficient reply
6. Factory has ISO certification, and the products comply to RoHS standard.
7. Our products are exported to the United States, Germany, UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, service        or cost performance has been well recognized

Outline SizeMaterialSurface ResistanceServiceFlatnessColor
2"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.2mmCustomizable
3"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.25mmCustomizable
4"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.3mmCustomizable
Custom sizeABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMTBCCustomizable
Provide professional design and packaging for your products

Product Application
Wafer Die / Bar / Chips                     PCBA module component
Electronic component packaging      Optical device packaging

Packaging Details:Packing according to customer's specified size
ESD Waffle Pack Electronic Components Tray 0
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

ESD Waffle Pack Electronic Components Tray 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

Send your inquiry directly to us (0 / 3000)