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2 Inch Waffle Pack IC Chip Tray

China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund


—— 本間宏紀

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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2 Inch Waffle Pack IC Chip Tray

2 Inch Waffle Pack IC Chip Tray
2 Inch Waffle Pack IC Chip Tray 2 Inch Waffle Pack IC Chip Tray 2 Inch Waffle Pack IC Chip Tray

Large Image :  2 Inch Waffle Pack IC Chip Tray

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN2078
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order and size of product
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day

2 Inch Waffle Pack IC Chip Tray

Material: ABS.PC.PPE.MPPO...etc Color: Black.Red.Yellow.Green.White..etc
Property: ESD Design: Standard
Size: 2 Inch Surface Resistance: 1.0x10E4~1.0x10E11Ω
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Injection Mold: Lead Time 20~25Days,Mold Life Span: 30~450,000 Times Molding Method: Injection Moulding
High Light:

Waffle Pack IC Chip Tray


Waffle IC Chip Tray


ic waffle pack tray

2 Inch Waffle Pack IC Chip Tray


Durable Antistatic Waffle Pack With Different Size Can Be Customized For Wafer Bare


High temperature tray is IC tray, IC tray is semiconductor chip enterprises for its chips for packaging and baking test carrier. Because it can be in 120℃-220℃bake environment without deformation characteristics, so the electronic waste industry commonly known as "high temperature plate"


Antistatic plastic tray can eliminate static electricity, a large number of electronic devices and products in the production process of turnover loading, packaging, storage and transportation. The finished product has good mechanical strength and heat resistance; Good impact resistance and chemical corrosion resistance. It will not change its anti-static performance due to the environment, time and temperature. It is mainly used in the electronic product industry.



1. Light weight, saving transportation and packaging costs;
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine;
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the most dozen capacity design, cost saving;
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement


Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products
Outline Line Size 50.7*50.7*4mm Brand Hiner-pack
Model HN2078 Package Type Die
Cavity Size 4.83*3.94*0.65 mm Matrix QTY 10*8=80PCS
Material PC Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS



Semiconductor Wafer Die Wafter Bare, Electronic components, optical electronic components, etc

2 Inch Waffle Pack IC Chip Tray 0



Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

2 Inch Waffle Pack IC Chip Tray 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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