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BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials

Certification
China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

—— 本間宏紀

이것은 귀 회사와의 두 번째 합작입니다.상품 가격 너무 좋아요.다시 올게요, 다음번 합작을 기대합니다!

—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials

BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials

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Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN2074
Payment & Shipping Terms:
Minimum Order Quantity: 500PCS(Low this QTY will charge machine-operating and injection fee)
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
Packaging Details: 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 2500PCS~3000PCS/per day

BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials

Description
Material: PPE Color: Black
Temperature: 80°C~180°C Property: ESD, Non-ESD
Surface Resistance: 1.0x10E4~1.0x10E11Ω Flatness: Less Than 0.76mm
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Customized Service: Support Standard And Non-standard,precision Machining Injection Mold: Customized Case Need(Lead Time 25~30Days,Mold Life Span: 300,000 Times.)
High Light:

BGA Custom Jedec Trays

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MPPO Custom Jedec Trays

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BGA jedec tray

BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
 
Customized Reusable High Temperature Anti-Static Holder For BGA Chips
 
 
Jedec trays is a standard-defined tray for transporting, handling, and storing complete chips and other components,and the production come in the very same outline dimensions of 12.7 inches by 5.35 inches (322.6 mm x 135.89 mm). Trays come in a number of different profiles .
 

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray .
 
Hiner offer the ultimate protection and convenience. We offer a wide variety of JEDEC outline matrix trays to satisfy the most demanding requirements of today's automatic test and handling environments. While JEDEC standards provide compatibility with process equipment, every device and component has its own requirements for tray pocket details .
 
Our Advantages
 
1. Flexible OEM service: we can produce products according to customer’s sample or design.
2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection molding,Production
4. Comprehensive customer service: from customer consultation to after sales service.
5. 10 years’ex perience of OEM for USA and EU customers.
6. We have our own factory and can control quality in high level and produce products quickly and flexibly.
 
Product Application
 
Electronic component       Semiconductor       Embedded System   Display technology
Micro and Nano systems  Sensor                   Test and Measurement Techology
Electromechanical equipment and systems    Power supply
 

Outline Line Size322.6*135.9*7.62mmBrandHiner-pack
ModelHN 2074Package TypeBGA IC
Cavity Size10.8*5.3*1.1mmMatrix QTY22*9=198PCS
MaterialPPEFlatnessMAX 0.76mm
ColorBlackServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS

 

MaterialBake TemperatureSurface Resistance
PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials 0
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept
EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

Send your inquiry directly to us (0 / 3000)