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ESD Waffle Pack Electronic Components Tray

ESD Waffle Pack Electronic Components Tray

Brand Name:	Hiner-pack
Model Number:	To meet all kinds of custom needs of customers
MOQ:	1000 pcs
Price:	0.25~0.55usd/pcs
Payment Terms:	T/T
Supply Ability:	The capacity is between 4000PCS~5000PCS/per day

Detail Information

Product Description

Detail Information

Place of Origin:

Made In China

Certification:

ISO 9001 ROHS SGS

Material:

ABS.PC.PPE.MPPO...etc

Color:

Black.Red.Yellow.Green.White..etc

Property:

ESD,Non-ESD

Design:

Standard And Non-standard

Size:

All Kinds Of

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Clean Class:

General And Ultrasonic Cleaning

Incoterms:

EXW,FOB,CIF,DDU,DDP

Injection Mold:

Lead Time 20~25Days,Mold Life Span: 30~450,000 Times

Molding Method:

Injection Moulding

Packaging Details:

It depends on the QTY of order and size of product

Supply Ability:

The capacity is between 4000PCS~5000PCS/per day

Highlight:

ESD Waffle Electronic Components Tray

SGS Electronic Components Tray

sgs ESD electronic tray

Product Description

ESD Waffle Pack Electronic Components Tray

Durable Antistatic ABS Non-Standard Waffle Pack With Different Size Can Be Customized For Optoelectronic Components

As the tray in the field of optical application, more and more customers to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized, provide one-stop service from design to production to packaging.

A chip tray is a carrier for bare dies used for the transportation and handling of a small batch of dies. A waffle pack is typically a plastic tray with pockets sized up for a particular die size.

IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).

Advantages:

1. More than 12 years of export experience.
2. With professional engineers and efficient management.
3. Short delivery time and good quality.
4. Support small batch production in the first batch.
5. Professional sales within 24 hours efficient reply.
6. The factory has ISO certification, and the products comply with the RoHS standard.
7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, with service and cost performance being well recognized.

Technical Parameters:

Outline Size	Material	Surface Resistance	Service	Flatness	Color
2"	ABS.PC.PPE...etc	1.0x10e4-1.0x10e11Ω	OEM, ODM	Max 0.2mm	Customizable
3"	ABS.PC.PPE...etc	1.0x10e4-1.0x10e11Ω	OEM, ODM	Max 0.25mm	Customizable
4"	ABS.PC.PPE...etc	1.0x10e4-1.0x10e11Ω	OEM, ODM	Max 0.3mm	Customizable
Custom size	ABS.PC.PPE...etc	1.0x10e4-1.0x10e11Ω	OEM, ODM	TBC	Customizable
Provide professional design and packaging for your products

FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value, and all samples shipping costs are normally is by collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support doing EXW, FOB, CNF, CIF, CFR, DDU, DAP. etc., and other terms as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, by express, by mail post according to customer order quantity and volume.
ESD Waffle Pack Electronic Components Tray 1

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

ESD Waffle Pack Electronic Components Tray

ESD Waffle Pack Electronic Components Tray

ESD Waffle Electronic Components Tray

SGS Electronic Components Tray

sgs ESD electronic tray

ESD Waffle Pack Electronic Components Tray

Advantages:

Technical Parameters:

FAQ: