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Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die

Certification
China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

—— 本間宏紀

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die

Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die
Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die
Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die

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Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: Outline Size 2inch 3Inch 4Inch
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: 4500~5000PCS/per day

Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die

Description
Material: ABS.PC.MPPO...etc Color: Black.Red.Yellow.Green.White..etc
Temperature: General 80°C~100°C Property: ESD,Non-ESD
Surface Resistance: 1.0x10E4~1.0x10E11Ω Warpage: Less Than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Customized Service: Suitable For All Kinds Of Bar.Die.Chip Devices Or Parts Injection Mold: Customized Case Need(Lead Time 20~25Days,Mold Life Span: 450,000 Times.)
High Light:

MPPO Waffle Pack Chip Trays

,

ODM Waffle Pack Chip Trays

,

MPPO waffle tray

Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die

 

Reuseable Antistatic ABS Standard Waffle Pack With Different Colors Can Be Customized For Wafer Die

 

Silicon dies can be delivered in a tray which is also known as waffle pack – a plastic tray with pockets that match the die size. A waffle pack has a lid and is delivered in an antistatic bag. Waffle packs are ideal for delivering small number of silicon dies, typically from a MPW process.

 

Waffle Pack is a form of packaging designed for use with parts that are either very small or unusual in shape. Waffle pack are embossed or pocketed trays, typically made of plastic, that resemble a breakfast waffle (hence the name). The waffle packs are loaded using pick and place equipment so that the "inside" of each pocket contains a part or component. Once loaded - the parts are covered with anti-static paper, and then a foam-covered crown holds the parts in place, and finally, a lid secures the waffle package together.

 

As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized,Provide one-stop service from design to production to packaging.

 

Product Application

 

Wafer Die / Bar / Chips PCBA module component

Electronic component packaging Optical device packaging


Packaging Details:Packing according to customer's specified size

 

Advanges

 

1. More than 10 years export experience

2. With professional engineers and efficient management

3. Short delivery time and good quality

4. Support small batch production in the first batch

5. Professional sales within 24 hours efficient reply

6. Factory has ISO certification, and the products comply to RoHS standard.

7. Our products are exported to the United States, Germany, UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, service or cost performance has been well recognized

 

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die 0

FAQ

 

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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