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ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For Electronic Die

ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For Electronic Die

Brand Name: Hiner-pack
Model Number: 4Inch
MOQ: 1000 pcs
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Payment Terms: T/T
Supply Ability: 4500~5000PCS/per day
Detail Information
Place of Origin:
Made In China
Certification:
ISO 9001 ROHS SGS
Material:
ABS.PC.MPPO...etc
Color:
Black.Red.Yellow.Green.White..etc
Temperature:
General 80°C~100°C
Property:
ESD
Surface Resistance:
1.0x10E4~1.0x10E11Ω
Warpage:
Less Than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class:
General And Ultrasonic Cleaning
Incoterms:
EXW,FOB,CIF,DDU,DDP
Packaging Details:
It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Supply Ability:
4500~5000PCS/per day
Highlight:

ROHS Waffle Pack Chip Trays

,

Wafer Waffle Pack Chip Trays

,

Waffle Jedec IC Trays

Product Description

ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For Electronic Die

Need a packaging solution for tiny semiconductor devices? These anti-static waffle packs offer excellent protection and organization.


For electronic products in the process of transportation and packing unavoidably will produce some friction, from the perspective of physics, friction causes electrostatic generation, and the temperature change in the weather outside, and will produce static electricity, the electrostatic if stay in electronic products, it is easy to cause a short-circuit damage to the precision of electronic products, to avoid this situation so its packaging materials require the use of good anti-static function of the pallet or packaging solutions.


Advantages:

1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transferring or loading samples for testing
3. Stable anti-static performance, a good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. It can be matched with the cover and clips of the same series, convenient to meet all kinds of shipping methods
6. Recycling, plastic material is easy to degrade after waste, with no environmental concerns
7. It can be stackable and can also ensure the design of maximum utilization of the tray matrix

Technical Parameters:

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM TBC Customizable
Provide professional design and packaging for your products

 

Cavity Size Customized Size
Item Material ABS / PC / MPPO / PPE... acceptable
OEM&ODM YES
Item Color Can be customized
Feature Durable; Reusable; Rcofriendly; Biodegradable
Sample A. The free samples: chosen from existing products.
B.  customized samples as per your design/demand 
MOQ 500pcs.
Packing Carton or as per the customer's request
Delivery time Usually 8-10 working days, depending on order quantity
Terms of payment Products: 100% prepayment. 
Mold: 50% T/T deposit, 50% balance after sample confirmation


Product Application:
Wafer Die / Bar / Chips / PCBA module component
Electronic component packaging and optical device packaging

 ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For Electronic Die 0
FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product values. And all samples are shipping costs normally by collect or as agreed.
Q: What kind of Incoterms can you do?
A: We could support doing Ex works, FOB, CNF, CIF, CFR, DDU, DAP, etc., and other incoterms as agreed.
Q: What method you can use to ship the goods?
A: By sea, by air, by express, by mail post according to customer order quantity and volume.

ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For Electronic Die 1

ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For Electronic Die 2