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ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

Certification
China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
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I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

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ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved
ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

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Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: To meet all kinds of custom needs of customers
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order and size of product
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day

ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

Description
Material: ABS.PC.PPE.MPPO...etc Color: Black.Red.Yellow.Green.White..etc
Property: ESD,Non-ESD Design: Standard And Non-standard
Size: All Kinds Of Surface Resistance: 1.0x10E4~1.0x10E11Ω
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Injection Mold: Lead Time 20~25Days,Mold Life Span: 30~450,000 Times Molding Method: Injection Moulding
High Light:

ESD Chip Waffle Tray

,

Jedec Waffle Tray

,

Waffle Jedec Trays

ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved

 

Antistatic Matrix Chip Tray For Moisture Protection In Normal Environment

 

IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).

 
Antistatic plastic tray can eliminate static electricity, a large number of electronic devices and products in the production process of turnover loading, packaging, storage and transportation. The finished product has good mechanical strength and heat resistance; Good impact resistance and chemical corrosion resistance. It will not change its anti-static performance due to the environment, time and temperature. It is mainly used in the electronic product industry.

 

Advantages

 

1. More than 10 years export experience

2. With professional engineers and efficient management

3. Short delivery time and good quality

4. Support small batch production in the first batch

5. Professional sales within 24 hours efficient reply

6. Factory has ISO certification, and the products comply to RoHS standard.

7. Our products are exported to the United States, Germany, UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, service        or cost performance has been well recognized

 

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

 

Outline Line Size 50*50*4mm Brand Hiner-pack
Model HN 210*210-24 Package Type IC Parts
Cavity Size 5.33*5.33*6.1mm Matrix QTY 7*7=49PCS
Material ABS Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS

 

Material Description

 

ESD Conductive Material

Also can be antistatic or Conductive and can be normal one .

 

Application

 

IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc

ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved 0

FAQ

 

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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