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QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness

Certification
China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

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QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness

QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness

Large Image :  QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN1968
Payment & Shipping Terms:
Minimum Order Quantity: 500PCS
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
Packaging Details: 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 2500PCS~3000PCS/per day

QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness

Description
Material: PPE Color: Black
Temperature: 125°C Property: ESD
Surface Resistance: 1.0x10E4~1.0x10E11Ω Flatness: Less Than 0.76mm
Incoterms: EXW,FOB,CIF,DDU,DDP Customized Service: Support Standard And Non-standard,precision Machining
High Light:

QFP ESD Plastic Trays

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SGS ESD Plastic Trays

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QFP esd tray

QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
 
Anti-static PPE Standard Jedec Trays Customized For Carry QFP Package IC
 
Detail Description:
 
Tray of QFP package way,Really need to pay special attention to protect the edge of the pin location, structure and shape, different pin each sensitive area is different need to be protected, IC tray design is the first need to consider is safe packing storage chip, the IC package of reason for different ways have different design methods, this QFP IC two side both have pin structure,Our designer added grooves on both sides, so that the pins can be placed smoothly to avoid being touched, and the middle card slot can also be fixed on the chip, so that it can be picked up by automatic equipment on the basis of safe storage of the chip, which is more conducive to shipment and storage.
 
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.
 
Outline Line Size 322.6*135.9*12.19mm Brand Hiner-pack
Model HN1968 Package Type QFP IC
Cavity Size 22*22*6.9 Matrix QTY 11*4=44pcs
Material PPE Flatness MAX 0.76mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS

 

Product Application

 

Package IC                                     PCBA module component

Electronic component packaging   Optical device packaging

 


Packaging


Packaging Details:Packing according to customer's specified size

 

Reference to temperature resistance of different materials

Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness 0

FAQ


1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept
EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

Send your inquiry directly to us (0 / 3000)