products

Home / Products / Jedec IC Trays /

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

Brand Name:	Hiner-pack
Model Number:	HN1903
MOQ:	1000 pcs
Price:	$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms:	T/T
Supply Ability:	The capacity is between 2500PCS~3000PCS/per day

Detail Information

Product Description

Detail Information

Place of Origin:

Made In China

Certification:

ISO 9001 ROHS SGS

Material:

MPPE

Color:

Black

Temperature:

140°C

Property:

ESD

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Flatness:

Less Than 0.76mm

Clean Class:

General And Ultrasonic Cleaning

Incoterms:

EXW,FOB,CIF,DDU,DDP

Customized Service:

Support Standard And Non-standard,precision Machining

Injection Mold:

Customized Case Need(Lead Time 25~30Days,Mold Life Span: 300,000 Times.)

Packaging Details:

80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm

Supply Ability:

The capacity is between 2500PCS~3000PCS/per day

Highlight:

ODM ESD Packaging Trays

PCB ESD Packaging Trays

ODM esd pcb tray

Product Description

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

Go beyond off-the-shelf—get JEDEC trays engineered for your chip’s shape, height, and transportation needs.

While the Jedec Tray is widely used in the semiconductor industry, the PCB module market is slowly recognizing and using custom trays to transport and load modules, because it can not only fully meet customer requirements in terms of performance, but also match the market demand for high-end modules. The IC Tray has been fully recognized in different industries. We have accumulated a wealth of experience in loading different ICs and modules, and have produced many similar series of trays.

The tray has a 45-degree chamfer to provide a visual indicator of Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip.

Application:

Package IC, PCBA module component, Electronic component packaging, Optical device packaging

Technical Parameters:

Brand	Hiner-pack	Outline Line Size	322.6135.97.62mm
Model	HN1903	Cavity Size	43383.25mm
Package Type	PCB Module	Matrix QTY	6*3=18PCS
Material	PPE	Flatness	MAX 0.76mm
Color	Black	Service	Accept OEM, ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	RoHS

Reference to the temperature resistance of different materials:

Material	Bake Temperature	Surface Resistance
PPE	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Powder	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Glass Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
PEI+Carbon Fiber	Max 180°C	1.010E4Ω~1.010E11Ω
IDP Color	85°C	1.010E6Ω~1.010E10Ω
Color, temperature, and other special requirements can be customized

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant 0

FAQ:

1. How can I get a quotation?
Reply: Please provide the details of your requirements as clearly as possible. So we can send you the offer for the first time.
For purchasing or further discussion, it is better to contact us via Skype / Email / Phone / WhatsApp, in case of any delays.

2. How long will it take to get a response?
Reply: We will reply to you within 24 hours of the working day.

3. What kind of service do we provide?
Reply: We can design IC Tray drawings in advance based on your clear description of the IC or component. Provide one-stop service from design to packaging and shipping.
4. What are your terms of delivery?
Reply: We accept EXW, FOB, CIF, DDU, DDP, etc. You can choose the one that is the most convenient or cost-effective for you.

5. How to guarantee quality?
Reply: Our samples through strict testing, and the finished products comply with the international JEDEC standards, to ensure a 100% qualified rate.

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant 1

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

ODM ESD Packaging Trays

PCB ESD Packaging Trays

ODM esd pcb tray

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

Application:

Technical Parameters:

FAQ: