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Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

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China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

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Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

Large Image :  Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: Jedec standard tray 322.6*135.9*7.62&12.19mm
Payment & Shipping Terms:
Minimum Order Quantity: 500PCS
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
Packaging Details: 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 2500PCS~3000PCS/per day

Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

Description
Material: MPPO Color: Black
Temperature: 125°C Property: ESD,Non-ESD
Surface Resistance: 1.0x10E4~1.0x10E11Ω Flatness: Less Than 0.76mm
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Use: Transport,Storage,Packing HS Code: 39239000
High Light:

MPPO ESD Component Tray

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BGA ESD Component Tray

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BGA esd tray

Waterproof Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
 
Waterproof Black MPPO Standard Jedec Trays Can Be Designed For BGA IC Devices
 
Jedec trays is a standard-defined tray for transporting, handling, and storing complete chips and other components,and the production come in the very same outline dimensions of 12.7 inches by 5.35 inches (322.6 mm x 135.89 mm). Trays come in a number of different profiles.

 

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.

 

Industrial Use:Electronic
Feature:Recyclable
Custom Order:Accept
Place of Origin:Shenzhen, China (Mainland)
Brand Name:Hiner-pack
Model Number:HN1890
Surface resistance:10e4-10e11 ohms
Color:Black
Property:Antistatic/ESD
Thickess:7.62mm
CAD drawing:available
Customized:width, length, thickness as customer request
Offer Designing:Yes

Outline Line Size 322.6*135.9*7.62mm Brand Hiner-pack
Model HN 1890 Package Type BGA IC
Cavity Size 6*8*1 mm Matrix QTY 24*16=384PCS
Material MPPO Flatness MAX 0.76mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS
 
Product Advantage
 
1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe, Korea, Japen...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.
 

 

Product Application

 

Electronic component          Semiconductor   Embedded System         Display technology

Micro and Nano systems     Sensor               Test and Measurement Techology
Electromechanical equipment and systems   Power supply


Reference to temperature resistance of different materials

Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices 0

FAQ

 

Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.

Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.

Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.

Q4: How about batch order production?
Ans: Normally 5-8days or so.

Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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