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Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature Resistance

Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature Resistance

Brand Name:	Hiner-pack
Model Number:	HN1839 Black
MOQ:	1000 pcs
Price:	$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms:	T/T
Supply Ability:	The capacity is between 2500PCS~3000PCS/per day

Detail Information

Product Description

Detail Information

Place of Origin:

Made In China

Certification:

ISO 9001 ROHS SGS

Material:

MPPO.PPE.ABS.PEI.IDP...etc

Color:

Black.Red.Yellow.Green.White..etc

Temperature:

80°C~180°C

Property:

ESD,Non-ESD

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Flatness:

Less Than 0.76mm

HS Code:

39239000

Use:

Transport,Storage,Packing

Packaging Details:

80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm

Supply Ability:

The capacity is between 2500PCS~3000PCS/per day

Highlight:

BGA Custom Jedec Trays

JEDEC Standard ESD Tray

BGA esd plastic trays

Product Description

Recycled ESD Custom Jedec Trays Transport BGA Chips High Temperature Resistance

Engineered for precision and protection, our JEDEC trays are fully customizable to fit your unique chip or module dimensions.

The design of the structure and shape in line with JEDEC international standards can also perfectly meet the requirements of the carrying components or IC of the tray, carrying function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, and improve work efficiency.

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip storage.We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.

Benefits:

• Able to present non-standard components to the Pick and Place machines.

• Multiple uses for the fixture, including component bake-out, storage, and shipping.

• Cost-effective alternative to “tape and reel” or “hand” placement.

Application:

IC, Electronic component, Semiconductor, Micro and Nano systems, and Sensor IC, etc.

Technical Parameters:

Model	HN1839	Package Type	BGA IC
Cavity Size	12121.8mm	Size	Customized
Material	PPE	Flatness	MAX 0.76mm
Resistance	1.0x10e4-1.0x10e11Ω	Service	Accept OEM, ODM
Color	Green &Black	Certificate	ROHS

Usage	Packaging of Electronic Components, Optical device,
Feature	ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
Material	MPPO.PPE.ABS.PEI.IDP...etc
Color	Black.Red.Yellow.Green.White and custom color
Size	Customized size, rectangle, circle shape
Mold type	Injection Mold
Design	Original sample, or we can create the designs
Packing	By Carton
Sample	Sample time: after the draft is confirmed and payment is arranged
	Sample charge: 1. Free for stock samples 2. Custom tray negotiated

Lead Time	5-7 Working days
Lead Time	The exact time should be according to the ordered quantity

Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature Resistance 0

FAQ:

Q1. Do your products get any certificates?
Yes, CE for the EU market, FDA for the USA market.

Q2.Can you do the design for us?
Yes. We have a professional team having rich experience in designing and manufacturing. Just tell us your ideas and we will help to carry out your ideas into a perfect fact. It does not matter if you do not have someone to complete the files. Send us high-resolution images, your logo, and text, and tell us how you would like to arrange them. We will send you finished files for confirmation.

Q3. How long is the delivery time?
For a standard machine, it would be 5- 7 working days. For non-standard/customized machines according to clients' specific requirements, It would be 20~25 working days.

Q4. Do you arrange shipments for the products?

It depends on our Incoterms. If it is FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Q5. How about the documents after shipment?
After shipment, we'll send all original documents to you by DHL, including Commercial Invoice, Packing List, B/L, and other certificates as required by clients.

Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature Resistance 1

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature Resistance

Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature Resistance

BGA Custom Jedec Trays

JEDEC Standard ESD Tray

BGA esd plastic trays

Benefits:

Application:

Technical Parameters:

FAQ:

Custom Jedec Trays

ISO Jedec Matrix Trays

Socket Jedec Matrix Trays

DRAM IC ESD Component Tray For Electronics Parts Packing

Sorting IC Components Custom Jedec Trays White Color Eco-Friendly

Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature Resistance

ABS Standard Red Jedec IC Tray Cover Anti Static ESD Trays