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Brand Name: | Hiner-pack |
Model Number: | HN2074 |
MOQ: | 1000 pcs |
Price: | $1.35~$2.38(Prices are determined according to different incoterms and quantities) |
Payment Terms: | T/T |
Supply Ability: | The capacity is between 2500PCS~3000PCS/per day |
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray .
Hiner offers the ultimate protection and convenience. We offer a wide variety of JEDEC outline matrix trays to satisfy the most demanding requirements of today's automatic test and handling environments. While JEDEC standards provide compatibility with process equipment, every device and component has its own requirements for tray pocket details
1. Flexible OEM service: We can produce products according to the customer’s sample or design.
2. Various Materials: The material can be MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection molding, Production
4. Comprehensive customer service: from customer consultation to after-sales service.
5. 12 years of experience in OEM for USA and EU customers.
6. We have our own factory and can control quality at a high level, and produce products quickly and flexibly
Electronic component, Semiconductor, Embedded System, Display technology, Micro and Nano systems Sensor, Test and Measurement Technology, Electromechanical equipment and systems, Power supply.
Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
Model | HN2074 | Package Type | BGA IC |
Cavity Size | 10.8*5.3*1.1mm | Matrix QTY | 22*9=198PCS |
Material | PPE | Flatness | MAX 0.76mm |
Color | Black | Service | Accept OEM, ODM |
Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Material | Bake Temperature | Surface Resistance |
PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
Color, temperature, and other special requirements can be customized |
1. How can I get a quotation?
Reply: Please provide the details of your requirements as clearly as possible. So we can send you the offer for the first time. For purchasing or further discussion, it is better to contact us via Skype / Email / Phone / WhatsApp, in case of any delays.
2. How long will it take to get a response?
Reply: We will reply to you within 24 hours of the working day.
3. What kind of service do we provide?
Reply: We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What are your terms of delivery?
Reply: We accept EXW, FOB, CIF, DDU, DDP, etc. You can choose the one that is the most convenient or cost-effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.