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BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials

BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials

Brand Name: Hiner-pack
Model Number: HN2074
MOQ: 1000 pcs
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
Payment Terms: T/T
Supply Ability: The capacity is between 2500PCS~3000PCS/per day
Detail Information
Place of Origin:
Made In China
Certification:
ISO 9001 ROHS SGS
Material:
PPE
Color:
Black
Temperature:
80°C~180°C
Property:
ESD, Non-ESD
Surface Resistance:
1.0x10E4~1.0x10E11Ω
Flatness:
Less Than 0.76mm
Clean Class:
General And Ultrasonic Cleaning
Incoterms:
EXW,FOB,CIF,DDU,DDP
Customized Service:
Support Standard And Non-standard,precision Machining
Injection Mold:
Customized Case Need(Lead Time 25~30Days,Mold Life Span: 300,000 Times.)
Packaging Details:
80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Supply Ability:
The capacity is between 2500PCS~3000PCS/per day
Highlight:

BGA Custom Jedec Trays

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MPPO Custom Jedec Trays

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BGA jedec tray

Product Description

BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials

From wafer-level chips to system-in-package modules, we design JEDEC trays that match your product’s shape and stacking needs.

Jedec trays is a standard-defined tray for transporting, handling, and storing complete chips and other components,and the production come in the very same outline dimensions of 12.7 inches by 5.35 inches (322.6 mm x 135.89 mm). Trays come in a number of different profiles.

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray .
 
Hiner offers the ultimate protection and convenience. We offer a wide variety of JEDEC outline matrix trays to satisfy the most demanding requirements of today's automatic test and handling environments. While JEDEC standards provide compatibility with process equipment, every device and component has its own requirements for tray pocket details

Advantages:

1. Flexible OEM service: We can produce products according to the customer’s sample or design.
2. Various Materials: The material can be MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection molding, Production
4. Comprehensive customer service: from customer consultation to after-sales service.
5. 12 years of experience in OEM for USA and EU customers.
6. We have our own factory and can control quality at a high level, and produce products quickly and flexibly

Application:

Electronic component, Semiconductor, Embedded System, Display technology, Micro and Nano systems  Sensor, Test and Measurement Technology, Electromechanical equipment and systems, Power supply.

Technical Parameters:

Brand Hiner-pack Outline Line Size 322.6*135.9*7.62mm
Model HN2074 Package Type BGA IC
Cavity Size 10.8*5.3*1.1mm Matrix QTY 22*9=198PCS
Material PPE Flatness MAX 0.76mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate RoHS


Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature, and other special requirements can be customized

BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials 0
FAQ:

1. How can I get a quotation?
Reply: Please provide the details of your requirements as clearly as possible. So we can send you the offer for the first time. For purchasing or further discussion, it is better to contact us via Skype / Email / Phone / WhatsApp, in case of any delays.
2. How long will it take to get a response?
Reply: We will reply to you within 24 hours of the working day.
3. What kind of service do we provide?
Reply: We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What are your terms of delivery?
Reply: We accept EXW, FOB, CIF, DDU, DDP, etc. You can choose the one that is the most convenient or cost-effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials 1