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Product Details:
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| Material: | PC | Color: | Black |
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| Temperature: | 100°C | Property: | ESD |
| Surface Resistance: | 1.0x10E4~1.0x10E11Ω | Flatness: | Less Than 0.3mm |
| Clean Class: | General And Ultrasonic Cleaning | Incoterms: | EXW,FOB,CIF,DDU,DDP |
| Highlight: | BGA Tray,Waterproof BGA Tray,BGA matrix trays |
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Custom molded tray will develop a custom pocket design to handle and protect your sensitive and micro devices. Trays are then CNC machined to the specific configuration for your part.
Our company has skillful and well-trained team in the field of Semiconductor packaging design to work out customer's requirements,for instance,different temperature,color,ESD property and cleanliness class etc.Experienced product structure engineering team can design various of IC chip,wafer,precision components packaging methods and specifications and other special demands to fit you well.
Hiner-pack production IC tray is in line with international environmental standards,through the ROHS and SGS third party inspection, such as raw material of the raw material buying from domestic leading manufacturer, incoming inspection and related technology and strictly control the quality during production, quality department must confirm the product 100% qualified before shipment, are sold to domestic and international famous customers over the years, After the use of positive feedback, rich experience in injection molding industry also provides customers with the most appropriate packaging solutions
Advantages
1. Flexible OEM service: we can produce products according to customer’s sample or design.
2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection molding,Production
4. Comprehensive customer service: from customer consultation to after sales service.
5. 10 years’ex perience of OEM for USA and EU customers.BGA Tray
6. We have our own factory and can control quality in high level and produce products quickly and flexibly.
Material Description
ESD Conductive Material
Also can be antistatic or Conductive and can be normal one .
Application
Semiconductor Wafer Die Wafter Bare, Electronic components, optical electronic components, etc
| Outline Line Size | 4 INCH |
| Model | HN21025 |
| Cavity Size | 6.3*5.3*1.4mm |
| Material | PC |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Brand | Hiner-pack |
| Package Type | IC Parts |
| Matrix QTY | 9*9=81PCS |
| Flatness | MAX 0.3mm |
| Service | Accept OEM,ODM |
| Certificate | ROHS |
FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize
the project depending on the specific time
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
