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ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

Brand Name:	Hiner-pack
Model Number:	HN2099 Lid
MOQ:	1000
Price:	$0.28~0.55
Payment Terms:	T/T
Supply Ability:	5000PCS~6000PCS per day

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen China

Certification:

ISO 9001 ROHS SGS

Property:

ESD

Color:

Black

Material:

Size:

101.5*101.5mm

Height:

4.8mm

Use:

Transport,Storage,Packing

HS Code:

39239000

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Packaging Details:

It depends on the QTY of order and size of product

Supply Ability:

5000PCS~6000PCS per day

Highlight:

ESD Waffle Tray Packaging Lids

4inch Waffle Tray Packaging Lids

ISO Waffle Tray Pack Lids

Product Description

ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

High Temperature Durable 4 Inch Black Waffle Pack Lids For IC Chip Tray Cover

The cover and insert materials are generally made of ABS or PC and industry standard anti-static Tyvek paper.

Manual placement, dislocation, and squeezing of the Tyvek paper are avoided when loading the waffle package

Seal each individual pallet pocket evenly

Compensate for normal waffle packaging cover/tray warping conditions, resulting in notching, fixed product elements do not move

Save a lot of scrap costs caused by yield loss, rework, and mold component movement.

Advantages:

1. Suitable for components or devices with daily turnover or long-distance freight;
2. Can be stacked with more layers;
3. Can be washed at high temperature;
4. Plastic waterproof, moisture-proof, improves the storage time of components;
5. No extrusion and breakage, Better protection components；
6. Reusable, quality assurance.

Application:

Wafer Dicing; Wafer Sorting; Wafer / Die Pick and place; Wafer/ Die Shipping.

Technical Parameters:

Usage	Packaging of Electronic Components, Optical device
Feature	ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
Material	PC, ABS...etc
Color	Black.Red.Yellow.Green.White and custom color
Size	Customized size, rectangle, circle shape
Mold type	Injection Mold
Design	Original sample, or we can create the designs
Packing	By Carton
Sample	Sample time: after the draft is confirmed and payment is arranged
	Sample charge: 1. Free for stock samples 2. Custom Tray negotiated

Lead Time	5-7 Working days
Lead Time	The exact time should be according to the ordered quantity

waffle pack ic chip tray cover

FAQ:

Q1: Are you a manufacturer?
A: Yes, we are a 100% manufacturer specializing in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.

Q2: What information should we supply if we want a quotation?
A: Drawing of your IC or component, Quantity, and size normally.

Q3: How long could you prepare samples?
A: Normally, 3 days. If customized, open a new mold 25~30 days around.

Q4: How about batch order production?
A: Normally 5- 7 working days or so.

Q5: Do you inspect the finished products?
A: Yes, we will inspect according to the ISO 9001 standard and be ruled by our QC staff.

waffle pack ic chip tray lid

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

ESD Waffle Tray Packaging Lids

4inch Waffle Tray Packaging Lids

ISO Waffle Tray Pack Lids

ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

Advantages:

Application:

Technical Parameters:

FAQ: