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Product Details:
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| Material: | PC | Color: | Black |
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| Temperature: | 100°C | Property: | ESD |
| Surface Resistance: | 1.0x10E4~1.0x10E11Ω | Flatness: | Less Than 0.4mm |
| Use: | Transport,Storage,Packing | HS Code: | 39239000 |
| Highlight: | Lightweight ic packaging tray,ESD ic packaging tray,ESD ic tray packaging |
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Through Hole Structure IC Packaging Tray Lightweight Moisture Proof
Through Hole Structure Plastic ESD Trays For Loading Electronic Components
Our company has skillful and well-trained team in the field of Semiconductor packaging design to work out customer's requirements,for instance,different temperature,color,ESD property and cleanliness class etc.Experienced product structure engineering team can design various of IC chip,wafer,precision components packaging methods and specifications and other special demands to fit you well.
The anti-static tray is made of special high-temperature resistant plastic by injection molding process, and the resistance value of the material surface is according to international standard.
The Key Differences Between ESD and Anti-Static.
Anti-static have a coating or chemical additive that dissipates static across its surface so you never build up enough charge to get a shock. ESD is a much more robust solution that delivers greater long-term results because it is actually earthed.
Advantages
1. Light weight, saving transportation and packaging costs;
2. Edge chamfer design, effectively prevent stacking error, correct the direction of placement
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the most dozen capacity design, cost saving;
Application
Semiconductor Wafer Die Wafer Bare, Electronic components, optical electronic components, etc
Character Reference
1. Material:ESD PC injection molding
2. Properties:release goods surface of goods static charge,so the goods will not produce charge accumulation and high potential difference.
3. Strong, moisture-proof and preservative
4. Use:cycle loading ,packaging storage and transportation in producing processing and electronic devices.
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Outline Line Size |
129.5*135*15.3mm |
Brand |
Hiner-pack |
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Model |
HN21033 |
Package Type |
IC |
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Cavity Size |
6.88*12.08*5.9mm |
Matrix QTY |
7*7=49PCS |
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Material |
PC |
Flatness |
MAX 0.4mm |
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Color |
Black |
Service |
Accept OEM,ODM |
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Resistance |
1.0x10e4-1.0x10e11Ω |
Certificate |
ROHS |
FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize
the project depending on the specific time.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
