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Product Details:
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| Material: | ABS.PC.MPPO...etc | Color: | Black.Red.Yellow.Green.White..etc |
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| Temperature: | General 80°C~100°C | Property: | ESD,Non-ESD |
| Surface Resistance: | 1.0x10E4~1.0x10E11Ω | Flatness: | 0.4mm |
| Customized Service: | Suitable For All Kinds Of Bar.Die.Chip Devices Or Parts | Injection Mold: | Customized Case Need(Lead Time 20~25Days,Mold Life Span: 450,000 Times.) |
| High Light: | ESD Blister Tray,Waterproof ESD Blister Tray,ESD blister packaging tray |
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Automated Pick Place Machine ESD Tray Recycling
Customize Anti-Static Trays For Automated Pick And Place Equipment
Why choose custom IC Tray?
Customization means specificity, the unique cavity corresponds to the size and specification of your chip or electronic component, from the long. Each step is designed according to the external size and special parts of the chip or electronic components. The designed tray can be perfectly loaded with the chip or electronic components provided by you to ensure the smooth loading and storage in the process of use.
Our company has rich experience in the industry of injection molding. IC Tray and JEDEC Tray are the first production lines introduced by us. Over the years, we have customized a variety of different and diversified packaging solutions for customers.
The company is located in Shenzhen, China, and all the raw material suppliers are from China. All the suppliers have completed a complete supplier system audit step by step from pre-selection - alternative - election - selection, and strictly controlled IQC incoming material inspection and other procedures to provide a strong guarantee and reserve for product output and supply.
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
Advantages
1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transfer or loading samples for testing
3. Stable anti-static performance, good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. Recycling, plastic material is easy to degrade after waste, no environmental concerns
6. It can be stack-able and can also ensure the design of maximum utilization of tray matrix
| Usage | Packaging of Electronic Components,Optical device, ESD Blister Tray |
| Feature | ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly |
| Material | MPPO.PPE.ABS.PEI.IDP...etc |
| Color | Black.Red.Yellow.Green.White and custom color |
| Size | Customized size, rectangle,circle shape |
| Mold type | Injection Mold |
| Design | Original sample or we can create the designs |
| Packing | By Carton |
| Sample | Sample time: after draft confirmed and payment arranged |
| Sample charge: 1. Free for stock samples | |
| 2. Custom Tray negotiated | |
| Lead Time | 5-7 Working days |
| The exact time should according to the ordered quantity |
FAQ
Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.
Q4: How about batch order production?
Ans: Normally 5-8days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
