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PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type

Brand Name: Hiner-pack
Model Number: HN21062
MOQ: 1000 pcs
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
Payment Terms: T/T
Supply Ability: The capacity is between 2500PCS~3000PCS/per day
Detail Information
Place of Origin:
Made In China
Certification:
ISO 9001 ROHS SGS
Material:
PPE
Color:
Black
Temperature:
150°C
Property:
ESD
Surface Resistance:
1.0x10E4~1.0x10E11Ω
Flatness:
Less Than 0.76mm
OEM&ODM:
Accept
Mold Type:
Injection
Packaging Details:
80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Supply Ability:
The capacity is between 2500PCS~3000PCS/per day
Highlight:

ESD Jedec IC Tray

,

PPE Jedec IC Tray

,

LGA Jedec IC Tray

Product Description

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type

 

High Quality Jedec IC Tray For LGA Chip Package Type

 

 

  • ROHS Customized high temperature tray for LGA chip placement function

 

Quick Description:

 

 

 

 

 

Outline Line Size

322.6*135.9*8.5mm

Brand

Hiner-pack

Model

HN 21062

Package Type

LGA

Cavity Size

28.2*28.2*3.35mm

Matrix QTY

3*9=27PCS

Material

PPE

Flatness

MAX 0.76mm

Color

Black

Service

Accept OEM,ODM

Resistance

1.0x10e4-1.0x10e11Ω

Certificate

ROHS

 

In the microelectronics industry, there are standards for handling, loading, transporting and storing integrated circuit IC, modules and other electronic components. This is usually referred to as Jedec standard matrix trays. The Jedec Standard Tray is made from molded plastic particles. The Jedec standard Tray is very strong with minimal warpage control to achieve maximum protection of these components.

 

All Jedc matrix trays are 12.7*5.35inch(322.6*135.9mm) and are suitable for a variety of chip packages, including BGA.CSP.QFP.QFN... And so on.

 

Many Jedec tray slots are designed in the middle of the tray to allow automatic equipment to pick up the loaded product.

45-degree chamfer is also easier for equipment to identify and locate, thereby reducing labor costs.

 

Poduct Application

 

Package IC                                          PCBA module component

Electronic component packaging         Optical device packaging

 


Packaging Details:Packing according to customer's specified size

 

 

Reference to temperature resistance of different materials

 

 

 

Material

Bake Temperature

Surface Resistance

PPE

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

MPPO+Carbon Fiber

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

MPPO+Carbon Powder

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

MPPO+Glass Fiber

Bake 125°C~Max 150°C

1.0*10E4Ω~1.0*10E11Ω

PEI+Carbon Fiber

Max 180°C

1.0*10E4Ω~1.0*10E11Ω

IDP Color

85°C

1.0*10E6Ω~1.0*10E10Ω

Color, temperature and other special requirements can be customized

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type 0

FAQ


1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

PPE Black ESD Jedec IC Tray High Temperature For LGA Chip Package Type 1