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ROHS Black ESD JEDEC Tray High Temperature Resistant For LGA IC Chips

Brand Name:	Hiner-pack
Model Number:	HN21061
MOQ:	1000 pcs
Price:	$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms:	T/T
Supply Ability:	The capacity is between 2500PCS~3000PCS/per day

Detail Information

Product Description

Detail Information

Place of Origin:

Made In China

Certification:

ISO 9001 ROHS SGS

Material:

PPE

Color:

Black

Temperature:

150°C

Property:

ESD

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Flatness:

Less Than 0.76mm

OEM&ODM:

Mold Type:

Injection

Packaging Details:

80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm

Supply Ability:

The capacity is between 2500PCS~3000PCS/per day

Highlight:

ESD JEDEC Tray

Black ESD JEDEC Tray

ROHS JEDEC IC Trays

Product Description

ROHS Black ESD JEDEC Tray High Temperature Resistant For LGA IC Chips

High temperature resistant and antistatic IC JEDEC tray

Detail Description:

Outline Line Size	322.6135.98.5mm	Brand	Hiner-pack
Model	HN 21061	IC Package Type	LGA
Cavity Size	20.220.23.35mm	Matrix QTY	5*12=60PCS
Material	PPE	Flatness	MAX 0.76mm
Color	Black	Service	Accept OEM,ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	ROHS

All Jedc matrix trays are 12.7*5.35inch(322.6*135.9mm) and are suitable for a variety of chip packages, including BGA.CSP.QFP.QFN... And so on.

Location of Filler Pockets for Vacuum Chuck

The filler pockets for vacuum chuck shall be formed as follows:

(1) One at the center of the tray and one on each end, as located in Tables 2 and 3.

(2) The center filler pocket shall be 32 x 32 mm at least.

JEDEC tray is compatible with JEDEC tray feeder, reducing manual handling and loading and other processes, providing a complete automation service for efficient production, realizing automatic picking during assembly, avoiding damage to chips and avoiding manual picking and chip oxidation.

Product Application

Electronic component Semiconductor Embedded System Display technology

Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply

Reference to temperature resistance of different materials

Material	Bake Temperature	Surface Resistance
PPE	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Powder	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Glass Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
PEI+Carbon Fiber	Max 180°C	1.010E4Ω~1.010E11Ω
IDP Color	85°C	1.010E6Ω~1.010E10Ω
Color, temperature and other special requirements can be customized

ROHS Black ESD JEDEC Tray High Temperature Resistant For LGA IC Chips 0

Advantage

1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years experience of OEM for USA and EU customers.

6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

ROHS Black ESD JEDEC Tray High Temperature Resistant For LGA IC Chips 1

Anti-static tray is an ideal tool for storing electronic components. It is made of special polymer chains added in the raw materials, so it has permanent electrostatic dissipation performance.Anti-static tray has good mechanical strength and heat resistance, good impact strength, strong chemical corrosion resistance, and will not change its anti-static performance due to the environment, time and temperature.

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

ROHS Black ESD JEDEC Tray High Temperature Resistant For LGA IC Chips

ROHS Black ESD JEDEC Tray High Temperature Resistant For LGA IC Chips

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