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Packing Wafer Die PC Bare Die Trays ESD Injection Moulding

Packing Wafer Die PC Bare Die Trays ESD Injection Moulding

Brand Name:	Hiner-pack
Model Number:	HN21070
MOQ:	1000 pcs
Price:	$0.35~$0.85(Prices are determined according to different incoterms and quantities）
Payment Terms:	T/T
Supply Ability:	The capacity is between 4000PCS~5000PCS/per day

Detail Information

Product Description

Detail Information

Place of Origin:

Made In China

Certification:

ISO 9001 ROHS SGS

Material:

Color:

Black

Property:

ESD

Design:

Non-standard

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Clean Class:

General And Ultrasonic Cleaning

Injection Mold:

Lead Time 20~25Days,Mold Life Span: 30~450,000 Times

Molding Method:

Injection Moulding

Packaging Details:

It depends on the QTY of order and size of product

Supply Ability:

The capacity is between 4000PCS~5000PCS/per day

Highlight:

PC Bare Die Trays

ESD Bare Die Trays

ESD bare die tray

Product Description

Packing Wafer Die PC Bare Die Trays ESD Injection Moulding

Waffle Pack Chip Carriers Series Products Used For Packing Wafer Die

Waffle pack compared with other method has many advantages, it can be placed not only very tiny components or parts, and the flexibility to match the lid and clip to raise product real ease of use, can satisfy the customer the different demand for samples and production loading respectively, at the same time can also be applied to automated production, easy to use and save the packaging cost.

How do you open a waffle pack?

Remove carrier clip. ...
Place lidded waffle pack onto a flat ESD surface. ...
Gently tap cover using the handle of a set of tweezers. ...
Lift cover.
Remove die from carrier.

Reference Detail

Outline Size	50.850.83.94mm	Brand	Hiner-pack
Model	HN21022	Package Type	N/A
Cavity Size	3.986.111.08mm	Matrix QTY	6*8=48PCS
Material	PC	Flatness	MAX 0.2mm
Color	Black	Service	Accept OEM,ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	ROHS SGS

Outline Size	Material	Surface Resistance	Service	Flatness	Color
2"	ABS.PC.PPE...etc	1.0x10e4-1.0x10e11Ω	OEM,ODM	Max 0.2mm	Customizable
3"	ABS.PC.PPE...etc	1.0x10e4-1.0x10e11Ω	OEM,ODM	Max 0.25mm	Customizable
4"	ABS.PC.PPE...etc	1.0x10e4-1.0x10e11Ω	OEM,ODM	Max 0.3mm	Customizable
Custom size	ABS.PC.PPE...etc	1.0x10e4-1.0x10e11Ω	OEM,ODM	TBC	Customizable
Provide professional design and packaging for your products

Packing Wafer Die PC Bare Die Trays ESD Injection Moulding 0

Application

IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc

Advantage

1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe, Korea, Japan...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.

FAQ

Q1. Do your products get any certificates?
Yes, CE for EU market, FDA for USA market.
Q2.Can you do the design for us?
Yes. We have a professional team having rich experience in designing and manufacturing. Just tell us your ideas and we will help to carry out your ideas into perfect fact. It does not matter if you do not have some one to complete files. Send us high resolution images, your logo and text and tell us how you would like to arrange them. We will send you finished files for confirmation.
Q3. How long is the delivery time?
For standard machine, it would be 5-7Working days. For non-standard/customized machines according to clients' specific requirements, It would be 20~25 working days.

Q4. Do you arrange shipment for the products?

It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Q5. How about the documents after shipment?
After shipment, we'll send all original documents to you by DHL, including Commercial Invoice, Packing List, B/L and other certificates as required by clients.

Packing Wafer Die PC Bare Die Trays ESD Injection Moulding 1

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

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Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

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Electronic Components Tray

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Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

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