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Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips

China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
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I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund


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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

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Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips

Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips
Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips

Large Image :  Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN21077
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: 4500~5000PCS/per day

Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips

Material: PC Color: Black.Red.Yellow.Green.White..etc
Temperature: General 80°C~100°C Property: ESD,Non-ESD
Surface Resistance: 1.0x10E4~1.0x10E11Ω Warpage: Less Than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Customized Service: Suitable For All Kinds Of Bar.Die.Chip Devices Or Parts Injection Mold: Customized Case Need(Lead Time 20~25Days,Mold Life Span: 450,000 Times.)
High Light:

Wafer Die Waffle Pack Tray


4 Inch Waffle Pack Tray


Wafer Die Waffle Pack Chip Trays

High Quality Black 4 Inch ESD Waffle Pack for Micro IC Chips


Hiner-pack production IC tray waffle pack is in line with international environmental standards,through the ROHS and SGS third party inspection, such as raw material of the raw material buying from domestic leading manufacturer, incoming inspection and related technology and strictly control the quality during production, quality department must confirm the product 100% qualified before shipment, are sold to domestic and international famous customers over the years, After the use of positive feedback, rich experience in injection molding industry also provides customers with the most appropriate packaging solutions.


It is by virtue of excellent professional team and unremitting efforts that Hiner-pack has been widely recognized by customers in the field of semiconductor materials.We take quality as the basis of survival and development, cooperate with customers and partners, long-term development, committed to become the semiconductor industry manufacturing and process materials in the world's leading service providers.


Details About HN21077 ESD Waffle Pack


The HN21077 is usually used to carry smaller chips or components, And the product can be matched with the cover plate, clip, Tyvek paper and other corresponding accessories. Our company provides complete packaging services to ensure the safety of customers' product transfer, transportation and storage.

Outline Line Size 101.6*101.6*4.5mm Brand Hiner-pack
Model HN21077 Package Type IC Parts
Cavity Size 13.2*1.2*0.32mm Matrix QTY 26*5=130PCS
Material PC Flatness MAX 0.1mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS


Product Application Of Waffle Tray


Wafer Die / Bar / Chips                            PCBA module component

Electronic component packaging             Optical device packaging


Packaging Of Chip Tray


Packaging Details:Cartons or packing according to customer's requirements

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products




1. We have sample stock, also can help the client to choose which type is suitable for them.

2. We will reply you in any time if you have questions.

3. Choose suitable product for clients according to clients' requirement.

4.After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity

Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips 0


Q1: Are You Manufacturer or Trade Company?

A:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China..
Q2. Can I order if quantity less than MOQ?
A:Yes and it would be taken as sample order to production. We take more serious on sample order.
Q3. Can I get Free Samples?
A:Yes, If samples we have in stock would be provided for testing, but shipment should at your side.
If samples are needed to customize with your logo and designs, please send us designs and advise chip, quantity, and any other details required. Thank you.

Q4. Do you arrange shipment for the products?

A:It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Wafer Die Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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