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SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging

Certification
China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging

SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging
SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging

Large Image :  SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN21082
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order and size of product
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day

SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging

Description
Material: PC Color: Black
Property: ESD Design: Standard
Size: 4 Inch Surface Resistance: 1.0x10E4~1.0x10E11Ω
Clean Class: General And Ultrasonic Cleaning Use: Transport,Storage,Packing
High Light:

SGS Waffle Pack Chip Trays

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0.2mm Waffle Pack Chip Trays

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Optical Device Packaging Chip Trays

SGS Chip Tray Waffle Pack For Optical Device Packaging 0.2mm Flatness

 

A semiconductor packing material is a material whose ability to conduct electricity is intermediate between a conductor and an insulator. It is a kind of electronic material with semiconductor properties, which can be used to make semiconductor devices and integrated electricity. Its conductivity is in the range of 10 (U-3) ~ 10 (U-9) ohm/cm. In some cases, a semiconductor has the property of conducting electricity.

 

Waffle Pack is a form of packaging designed for use with parts that are either very small or unusual in shape. Waffle pack are embossed or pocketed trays, typically made of plastic, that resemble a breakfast waffle (hence the name). The waffle packs are loaded using pick and place equipment so that the "inside" of each pocket contains a part or component. Once loaded - the parts are covered with anti-static paper, and then a foam-covered crown holds the parts in place, and finally, a lid secures the waffle package together.

 

Details about HN21082 Customized PC 4 Inch Waffle Pack

 

PC is a kind of amorphous thermoplastic resin with excellent comprehensive performance, which makes the HN21082 waffle pack excellent electrical insulation, elongation, dimensional stability and chemical corrosion resistance. At the same time with self-extinguishing, flame retardant, non-toxic, coloring and other advantages to ensure the safety of customers' products.

Outline Line Size 50*50*4.0mm Brand Hiner-pack
Model HN21082 Package Type IC Parts
Cavity Size 18.5*0.95*0.32mm Matrix QTY 12*2=24PCS
Material PC Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 10E04Ω-10E11Ω Certificate SGS

 

Application Of Waffle Pack


Semiconductor                      Electronic component factories
SMT Surfacing factories       Optical industry

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

Advantages

 

1. Light weight, saving transportation and packaging costs
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release
4. High temperature resistance, suitable for high temperature automation equipment assembly
5. Corrosion resistance, suitable for all kinds of production conditions of products
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement

SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging 0

FAQ

 

Q1: Are You Manufacturer or Trade Company?

A:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

A:ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

A:Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

A:Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

A:Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?

A:Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?

A:We can send you them right now if you are interested in something we have stock, and

the project depending on the specific time.

SGS 0.2mm Flatness Waffle Pack Chip Trays For Optical Device Packaging 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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