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ESD Black ABS 4 Inch Chip Tray For Electronic Parts 0.3mm Flatness

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China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
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ESD Black ABS 4 Inch Chip Tray For Electronic Parts 0.3mm Flatness

ESD Black ABS 4 Inch Chip Tray For Electronic Parts 0.3mm Flatness
ESD Black ABS 4 Inch Chip Tray For Electronic Parts 0.3mm Flatness ESD Black ABS 4 Inch Chip Tray For Electronic Parts 0.3mm Flatness ESD Black ABS 4 Inch Chip Tray For Electronic Parts 0.3mm Flatness ESD Black ABS 4 Inch Chip Tray For Electronic Parts 0.3mm Flatness

Large Image :  ESD Black ABS 4 Inch Chip Tray For Electronic Parts 0.3mm Flatness

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN21094
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order and size of product
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day

ESD Black ABS 4 Inch Chip Tray For Electronic Parts 0.3mm Flatness

Description
Material: ABS Color: Black
Property: ESD Design: Standard And Non-standard
Size: 4 Inch Surface Resistance: 1.0x10E4~1.0x10E11Ω
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Injection Mold: Lead Time 20~25Days,Mold Life Span: 300~450K Times Molding Method: Injection Moulding
High Light:

ROHS ABS Chip Tray

,

ABS Electronic Parts Chip Tray

,

0.2mm Flatness Waffle Pack Chip Trays

ESD Black ABS 4 Inch Chip Tray for Electronic Parts 0.3 Flatness

 

The ESD tray is made of special high temperature resistant plastic and injection molding process. The resistance value of the material surface is 1.0x10e4 to1.0x10e11Ω. Because it can eliminate the static electricity of products, it is widely used in the turnover of loading, packaging, storage and transportation of electronic devices and the production process.

 

It is also known as conducting electrostatic tray which is a container for the storage of precision electronic components in the industry. According to the customer's electronic component requirements, Hiner-pack can also provide different sizes of waffle pack.

 

1.Details about the HN21094 ESD Black ABS 4 Inch Chip Tray 

 

The HN21094 Waffle Pack is made of ABS, a good conducting material. This material can effectively release the static charge accumulated on the surface of the object, greatly reducing the damage rate of electronic products in the production process. This design not only reduces costs, but also improves product quality and profits.

 

At the same time, it also has anti-bending, anti-aging,  high-bearing , stackable and other functions. We can customize all kinds of specifications and sizes according to user needs. It can be equipped with cover, dust proof and beautiful appearance. The ESD tray is designed and manufactured according to the size provided by customers to achieve the most reasonable loading.In addition, multiple trays can be overlapped to increase the storage of electronic components, PCB boards and dust-free workshop parts, so as to save production costs.

Outline Line Size 101.6*101.6*5.5mm Brand Hiner-pack
Model HN21094 Package Type Die
Cavity Size 3.2*4.2*1.78 Matrix QTY 10*10=100PCS
Material ABS Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS

 

2.Application of the HN21094 ESD Black ABS Waffle pack

 

IC Electronic component   Semiconductor     Micro and Nano systems and Sensor IC

 

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

3.Our Service

 

1. We have sample stock and also can help the client to choose the type which is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

ESD Black ABS 4 Inch Chip Tray For Electronic Parts 0.3mm Flatness 0

4.FAQ

 

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

ESD Black ABS 4 Inch Chip Tray For Electronic Parts 0.3mm Flatness 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

Send your inquiry directly to us (0 / 3000)