|Surface Resistance:||1.0x10E4~1.0x10E11Ω||Warpage:||Less Than 0.2mm(2Inch) 0.3mm(4Inch)|
|Clean Class:||General And Ultrasonic Cleaning||Incoterms:||EXW,FOB,CIF,DDU,DDP|
|Customized Service:||Suitable For All Kinds Of Bar.Die.Chip Devices Or Parts||Injection Mold:||Customized Case Need(Lead Time 20~25Days,Mold Life Span: 450,000 Times.)|
ABS Waffle Pack Tray,
Micro IC Chips Waffle Pack Tray,
4 Inch Waffle Pack Chip Trays
ABS Black 4 Inch Waffle Pack for Micro IC Chips
The ABS Waffle Pack is an ideal tray for storing tiny ic chip, which has permanent anti-static performance. In the process of using, it has good mechanical strength and heat resistance. Meanwhile, the product has good impact strength and chemical corrosion resistance, and will not be affected by the environment, time and temperature to change its ESD performance.
1.Details about the HN21097 ABS Black 4 Inch Waffle Pack for Micro IC Chips
Because the IC chip is prone to friction during storage and transportation, the quality of the product may be affected or even damaged if the ESD property is not available. Customers can use the HN21097 Waffle pack made of ABS to store electronic components or ic chips, which can effectively avoid short circuit.
The waffle pack can effectively release the static charge accumulated on the surface of the object, so that it will not produce large charge and high potential difference. Therefore, it can lower the damage rate of the product in the production process and transportation, reducing the cost of the product and improve the quality and profit.
|Outline Line Size||101.6*101.6*9mm||Brand||Hiner-pack|
|Cavity Size||4.35*5.45*2.5||Matrix QTY||10*14=140PCS|
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.
|Material||Bake Temperature||Surface Resistance|
|PPE||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Carbon Fiber||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Carbon Powder||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Glass Fiber||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|PEI+Carbon Fiber||Max 180°C||1.0*10E4Ω~1.0*10E11Ω|
|Color, temperature and other special requirements can be customized|
1. Suitable for components or devices daily turnover or long-distance freight.
2. Can be stacked more layers.
3. Can be washed at high temperature.
4. Plastic waterproof, moisture-proof, improve the storage time of components.
5. No extrusion and breakage, Better protection components.
6. Reusable, quality assurance.
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Contact Person: Rainbow Zhu
Tel: 86 15712074114