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ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips

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China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips

ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips
ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips

Large Image :  ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN21097
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: 4500~5000PCS/per day

ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips

Description
Material: ABS Color: Black.Red.Yellow.Green.White..etc
Temperature: General 80°C~100°C Property: ESD,Non-ESD
Surface Resistance: 1.0x10E4~1.0x10E11Ω Warpage: Less Than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Customized Service: Suitable For All Kinds Of Bar.Die.Chip Devices Or Parts Injection Mold: Customized Case Need(Lead Time 20~25Days,Mold Life Span: 450,000 Times.)
High Light:

ABS Waffle Pack Tray

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Micro IC Chips Waffle Pack Tray

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4 Inch Waffle Pack Chip Trays

ABS Black 4 Inch Waffle Pack for Micro IC Chips

 

The ABS Waffle Pack is an ideal tray for storing tiny ic chip, which has permanent anti-static performance. In the process of using, it has good mechanical strength and heat resistance. Meanwhile, the product has good impact strength and chemical corrosion resistance, and will not be affected by the environment, time and temperature to change its ESD performance.

 

1.Details about the HN21097 ABS Black 4 Inch Waffle Pack for Micro IC Chips

 

Because the IC chip is prone to friction during storage and transportation, the quality of the product may be affected or even damaged if the ESD property is not available. Customers can use the HN21097 Waffle pack made of ABS to store electronic components or ic chips, which can effectively avoid short circuit.

 

The waffle pack can effectively release the static charge accumulated on the surface of the object, so that it will not produce large charge and high potential difference. Therefore, it can lower the damage rate of the product in the production process and transportation, reducing the cost of the product and improve the quality and profit.

Outline Line Size 101.6*101.6*9mm Brand Hiner-pack
Model HN21097 Package Type Die
Cavity Size 4.35*5.45*2.5 Matrix QTY 10*14=140PCS
Material ABS Flatness MAX 0.3mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS

 

2.Our Service

 

1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

 

Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

 

3.Advantages

 

1. Suitable for components or devices daily turnover or long-distance freight.
2. Can be stacked more layers.
3. Can be washed at high temperature.
4. Plastic waterproof, moisture-proof, improve the storage time of components.
5. No extrusion and breakage, Better protection components.
6. Reusable, quality assurance.

ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips 0

4.FAQ

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.

ABS Black 4 Inch Waffle Pack Tray Suitable For Micro IC Chips 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

Send your inquiry directly to us (0 / 3000)