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ROHS Black Plastic Waffle Pack Chip Trays For Bare Die

China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund


—— 本間宏紀

이것은 귀 회사와의 두 번째 합작입니다.상품 가격 너무 좋아요.다시 올게요, 다음번 합작을 기대합니다!

—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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ROHS Black Plastic Waffle Pack Chip Trays For Bare Die

ROHS Black Plastic Waffle Pack Chip Trays For Bare Die
ROHS Black Plastic Waffle Pack Chip Trays For Bare Die ROHS Black Plastic Waffle Pack Chip Trays For Bare Die ROHS Black Plastic Waffle Pack Chip Trays For Bare Die

Large Image :  ROHS Black Plastic Waffle Pack Chip Trays For Bare Die

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN21114
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order and size of product
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day

ROHS Black Plastic Waffle Pack Chip Trays For Bare Die

Material: PC Color: Black
Matrix QTY: 13*7-1=90PCS Place Of Origin: CHINA
Surface Resistance: 1.0x10E4~1.0x10E11Ω Clean Class: General And Ultrasonic Cleaning
Injection Mold: Lead Time 20~25Days,Mold Life Span: 30~450,000 Times Molding Method: Injection Moulding
High Light:

Plastic Waffle Pack Chip Trays


Bare Die Waffle Pack Chip Trays


ROHS Chip Trays

ROHS Black Plastic Waffle Pack Chip Tray for Bare Die

The waffle pack is a carrier for loading and transporting the small bare chips. It is often a plastic tray with an evenly distributed matrix of pockets, suitable for a particular chip. The waffle pack got its name from its resemblance to a breakfast waffle. In the process of packaging, the factories usually use tweezers or automation equipment for loading. After the product is loaded, we will cover the the products with tyvek paper, and finally use matching lids and clamps to secure waffle pack.


Details of the HN21114 Waffle Pack

HN21114 Waffle Pack is made of PC.The material has good stability and can protect customers' electronic products well. The matrix design of 13*7 can also load more customers' products. In addition, multiple trays can overlap, increasing the storage of electronic components, PCB board and dust-free workshop parts, thus saving transportation costs.


Over the years, the chip tray produced by our company are exported to famous customers at home and abroad. With rich experience in injection molding industry, we also provide customers with the most suitable packaging service. Achieve the most reasonable loading according to the size and manufacturing requirements provided by the customer.

Outline Line Size 101.57*101.57*5.5mm Brand Hiner-pack
Model HN21114 Package Type Die
Cavity Size 4.7*11*1.8 Matrix QTY 13*7-1=90PCS
Material PC Flatness MAX 0.3mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS


Application of the HN21114 Chip Tray

IC Packaging Delivery Systems                               Electronic Component


Microelectronic Devices                                           Semiconductor  Wafer Bare

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products


Our Service

1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

ROHS Black Plastic Waffle Pack Chip Trays For Bare Die 0


Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?


Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock.

ROHS Black Plastic Waffle Pack Chip Trays For Bare Die 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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