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Product Details:
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| Material: | PC | Color: | Black |
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| Matrix QTY: | 3*4=12PCS | Place Of Origin: | CHINA |
| Surface Resistance: | 1.0x10E4~1.0x10E11Ω | Clean Class: | General And Ultrasonic Cleaning |
| Injection Mold: | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times | Molding Method: | Injection Moulding |
| High Light: | Matrix Waffle Pack Chip Tray,Square Waffle Pack Tray,Environmentally Friendly Waffle Pack Tray |
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Standrad Square Matrix Waffle Pack Chip Tray Match Lid Clip
Hiner-pack has many years of design and manufacturing experience in the field of injection molding products. We produce a wide range of waffle pack to meet the automation equipment requirements of many semiconductor customers.
Our products are available in a variety of sizes and materials to meet customer requirements such as high temperature baking,impact resistance ,ect.To provide products with a full range of electrostatic protection, as well as safe and convenient transportation.
Details of the HN21123 Chip Tray
The HN21123 Waffle pack is designed for small-scale production and storage of small series of components. Like the JEDEC trays, the waffle pack have a chamfer corner to indicate orientation. The step sizes (from pocket to pocket) in the horizontal and vertical direction are also copied from JEDEC trays.
The chip tray is mainly made of PC. The material has good consolidation and can protect customers' electronic products well.In addition, multiple trays can overlap, increasing the storage of electronic components, PCB board and dust-free workshop parts, thus saving transportation costs.
| Outline Line Size | 50.72*50.72*3.96mm | Brand | Hiner-pack |
| Model | HN21123 | Package Type | Devices |
| Cavity Size | 8.99*10.36*1.98 | Matrix QTY | 3*4=12PCS |
| Material | PC | HS Code | 3923900000 |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application of HN21120 Chip Tray
Semiconductor Display Technology
Electronic Component Packaging Optical Device Packaging
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
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2" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.2mm |
Customizable |
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3" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.25mm |
Customizable |
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4" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.3mm |
Customizable |
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Custom size |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
TBC |
Customizable |
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Provide professional design and packaging for your products |
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Service of IC Tray Manufacturer
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.
FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: How about batch order production?
Ans: Normally 5-8 days or so.
Q6:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
