|Surface Resistance:||1.0x10E4~1.0x10E11Ω||Flatness:||Less Than 0.76mm|
|Clean Class:||General And Ultrasonic Cleaning||Incoterms:||EXW,FOB,CIF,DDU,DDP|
|Customized Service:||Support Standard And Non-standard,precision Machining||Injection Mold:||Customized Case Need(Lead Time 25~30Days,Mold Life Span: 300,000 Times.)|
Jedec Shape IC Chip Tray,
0.76mm IC Chip Tray,
BGA Jedec Matrix Trays
According To Jedec Shape Standard Custom Jedec IC Tray
In the microelectronic industry, the standards have been established for the handling, loading, transportation and storage of IC,modules and other electronic components.These are usually referred to as Jedec standard matrix trays. It is suitable for all kinds of packages, including BGA,CSP,QFN,QFP,ect.
Details Of HN21127 Jedec Tray
The main material of HN21127 JEDEC tray is ABS,which is a kind of material with good anti-static, high temperature resistance and strong consolidation. The products made of this material are durable and do not pollute the environment. Our products have passed ROHS international environmental protection standards, customers do not have to worry about the environmental pollution after waste.
At the same time, the 8*8 matrix design can also maximize the loading of your products.The middle position of the tray slot will be designed to the adsorption area, which is convenient for automatic equipment to pick up the loaded products.The design of 45 degrees is also easier to be identified and positioned by the equipment, so as to achieve automatic use effect and reduce the cost.
|Outline Line Size||322.6*135.9*9.5mm||Brand||Hiner-pack|
|Cavity Size||14.08*8.3*3.62||Matrix QTY||8*8=64PCS|
|Color||Black||Place of origin||CHINA|
Application of HN211127 Matrix Tray
Electronic Component Factory SMT Surfacing Factory
Optical Industry Military Industry
|Material||Bake Temperature||Surface Resistance|
|PPE||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Carbon Fiber||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Carbon Powder||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Glass Fiber||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|PEI+Carbon Fiber||Max 180°C||1.0*10E4Ω~1.0*10E11Ω|
|Color, temperature and other special requirements can be customized|
1. Suitable for components or devices daily turnover or long-distance freight.
2. Can be stacked more layers.
3. Can be washed at high temperature.
4. Plastic waterproof, moisture-proof, improve the storage time of components.
5. No extrusion and breakage, Better protection components.
6. Reusable, quality assurance.
Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.
Q4: How about batch order production?
Ans: Normally 5-8 days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.
Contact Person: Rainbow Zhu
Tel: 86 15712074114