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Box Products High Cleanliness Waffle Pack Chip Trays For IC Packaging

Box Products High Cleanliness Waffle Pack Chip Trays For IC Packaging

Brand Name: Hiner-pack
Model Number: HN21130
MOQ: 1000 pcs
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day
Detail Information
Place of Origin:
Made In China
Certification:
ISO 9001 ROHS SGS
Material:
ABS
Color:
Black
Matrix QTY:
10*20=200PCS
Place Of Origin:
CHINA
Surface Resistance:
1.0x10E4~1.0x10E11Ω
Clean Class:
General And Ultrasonic Cleaning
Injection Mold:
Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method:
Injection Moulding
Packaging Details:
It depends on the QTY of order and size of product
Supply Ability:
The capacity is between 4000PCS~5000PCS/per day
Highlight:

Box Waffle Pack Chip Trays

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High Cleanliness Waffle Pack Trays

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IC Chip Waffle Pack Trays

Product Description

High Cleanliness Waffle Box Products For IC Chip Packaging

 

The waffle pack produced by Hiner-pack provides a safe and convenient packaging for Chip,Die,photoelectric appliance and other micro-electronic parts. Products are available in a variety of sizes and materials for customers to choose from, and we can also provide customized service according to customers' special requirements.

 

Our company has a professional research and development team, can solve any customer needs for temperature, color, ESD performance and cleanliness level. To provide customers with satisfactory products for our service tenet.

 

Details Of HN21130 Chip Tray

 

The HN21130 Waffle pack is designed to provide customers with clean, safe packaging and transportation of electronic chips and other products. It also has strong stability, anti-static and high temperature resistance and other functions. Customers choose the right chip tray according to the size of their products, This is to prevent the product from spinning or flipping in the pockets.

 

According to customers' different loading requirements, we also have matching lids, clamps and Tyvek paper for customers to choose from. Multiple waffle packs can be stacked on top of each other, increasing storage space for ic components and thus saving on production costs.

 

Outline Line Size 50.7*50.7*4mm Brand Hiner-pack
Model HN21130 Package Type Devices
Cavity Size 1.4*1.0*0.6 Matrix QTY 10*20=200PCS
Material ABS Flatness MAX 0.3mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS

 

Application Of HN21130 Chip Tray

 

Semiconductor                            Sensor

Display technology                      Test and Measurement Technology

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

Our Service

 

1. We have sample stock, also can help the client to choose which type is suitable for them.

2. We will reply you in any time if you have questions.

3. Choose suitable product for clients according to clients' requirement.

4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

Box Products High Cleanliness Waffle Pack Chip Trays For IC Packaging 0

FAQ

 

Q1: Are You Manufacturer or Trade Company?

Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3. Do you arrange shipment for the products?

Ans:It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Q4: How about batch order production?

Ans: Normally 5-8 days or so.

Q5:Do you inspect the finished products?

Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

Box Products High Cleanliness Waffle Pack Chip Trays For IC Packaging 1