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Product Details:
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| Material: | ABS | Color: | Black |
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| Matrix QTY: | 10*20=200PCS | Place Of Origin: | CHINA |
| Surface Resistance: | 1.0x10E4~1.0x10E11Ω | Clean Class: | General And Ultrasonic Cleaning |
| Injection Mold: | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times | Molding Method: | Injection Moulding |
| High Light: | Box Waffle Pack Chip Trays,High Cleanliness Waffle Pack Trays,IC Chip Waffle Pack Trays |
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High Cleanliness Waffle Box Products For IC Chip Packaging
The waffle pack produced by Hiner-pack provides a safe and convenient packaging for Chip,Die,photoelectric appliance and other micro-electronic parts. Products are available in a variety of sizes and materials for customers to choose from, and we can also provide customized service according to customers' special requirements.
Our company has a professional research and development team, can solve any customer needs for temperature, color, ESD performance and cleanliness level. To provide customers with satisfactory products for our service tenet.
Details Of HN21130 Chip Tray
The HN21130 Waffle pack is designed to provide customers with clean, safe packaging and transportation of electronic chips and other products. It also has strong stability, anti-static and high temperature resistance and other functions. Customers choose the right chip tray according to the size of their products, This is to prevent the product from spinning or flipping in the pockets.
According to customers' different loading requirements, we also have matching lids, clamps and Tyvek paper for customers to choose from. Multiple waffle packs can be stacked on top of each other, increasing storage space for ic components and thus saving on production costs.
| Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
| Model | HN21130 | Package Type | Devices |
| Cavity Size | 1.4*1.0*0.6 | Matrix QTY | 10*20=200PCS |
| Material | ABS | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application Of HN21130 Chip Tray
Semiconductor Sensor
Display technology Test and Measurement Technology
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Our Service
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.
FAQ
Q1: Are You Manufacturer or Trade Company?
Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3. Do you arrange shipment for the products?
Ans:It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.
Q4: How about batch order production?
Ans: Normally 5-8 days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
